Boyd Insulating Cover; Insulator Body Material Boyd 56-77-8G

Description
INSULATING COVER; Insulator Body Material:Mica; Thermal Conductivity:0.528W/ m.K; Breakdown Voltage Vbr:-; Thickness:0.1mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:4.5kV/mm; Product Range:- RoHS Compliant: Yes
Datasheet
Description
INSULATING COVER; Insulator Body Material:Mica; Thermal Conductivity:0.528W/ m.K; Breakdown Voltage Vbr:-; Thickness:0.1mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:4.5kV/mm; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Insulating Cover; Insulator Body Material Boyd - 18M8188 - Newark, An Avnet Company
Chicago, IL, United States
Insulating Cover; Insulator Body Material Boyd
18M8188
Insulating Cover; Insulator Body Material Boyd 18M8188
INSULATING COVER; Insulator Body Material:Mica; Thermal Conductivity:0.528W/ m.K; Breakdown Voltage Vbr:-; Thickness:0.1mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:4.5kV/mm; Product Range:- RoHS Compliant: Yes

INSULATING COVER; Insulator Body Material:Mica; Thermal Conductivity:0.528W/m.K; Breakdown Voltage Vbr:-; Thickness:0.1mm; Volume Resistivity:1015ohm-cm; Thermal Impedance:-; Dielectric Strength:4.5kV/mm; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 18M8188
Product Name Insulating Cover; Insulator Body Material Boyd
Thermal Conductivity 0.5280 W/m-K (0.3051 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Good elastic thermal conductive insulator for power supply - SC800-PI-2-K4 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Thermally Conductive, Electrically Non-Conductive Silicone Meets NASA Low Outgassing Specifications - MasterSil 323AO-LO - Master Bond, Inc.
Specs
Type High Dielectric
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Gap Filler, Foam in Place Gasket
View Details
Thermal Pads - 2457312 - RS Components, Ltd.
RS Components, Ltd.
Specs
Thermal Conductivity 1600 W/m-K (924 BTU-ft/hr-ft²-F)
View Details