Boyd Insulator; Insulator Body Material Boyd 56-77-11G

Description
INSULATOR; Insulator Body Material:Mica; Thermal Conductivity:0.528W/ m.K; Breakdown Voltage Vbr:-; Thickness:0.1mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:4.5kV/mm; Product Range:-; Body Material:MicaRoHS Compliant: Yes
  • Insulator; Insulator Body Material Boyd - 18M8187 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
INSULATOR; Insulator Body Material:Mica; Thermal Conductivity:0.528W/ m.K; Breakdown Voltage Vbr:-; Thickness:0.1mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:4.5kV/mm; Product Range:-; Body Material:MicaRoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Insulator; Insulator Body Material Boyd - 18M8187 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Insulator; Insulator Body Material Boyd
18M8187
Insulator; Insulator Body Material Boyd 18M8187
INSULATOR; Insulator Body Material:Mica; Thermal Conductivity:0.528W/ m.K; Breakdown Voltage Vbr:-; Thickness:0.1mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:4.5kV/mm; Product Range:-; Body Material:MicaRoHS Compliant: Yes

INSULATOR; Insulator Body Material:Mica; Thermal Conductivity:0.528W/m.K; Breakdown Voltage Vbr:-; Thickness:0.1mm; Volume Resistivity:1015ohm-cm; Thermal Impedance:-; Dielectric Strength:4.5kV/mm; Product Range:-; Body Material:MicaRoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 18M8187
Product Name Insulator; Insulator Body Material Boyd
Thermal Conductivity 0.5280 W/m-K (0.3051 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

High quality thermally conductive thermal gel putty - SE30 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
High quality thermally conductive thermal gel putty
SE30
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
CHT USA Inc.
2-Part, Silicone Potting Compound and Encapsulant, UL Listed
QSil-563
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Ripley™
E 468-2-7-55F
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D - 745D - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - DISSIPATOR 745D
745D
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details