Boyd Insulator; Insulator Body Material Boyd 5300AC 1.500G

Description
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes
Datasheet
Description
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Insulator; Insulator Body Material Boyd - 60M3747 - Newark, An Avnet Company
Chicago, IL, United States
Insulator; Insulator Body Material Boyd
60M3747
Insulator; Insulator Body Material Boyd 60M3747
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes

INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm-cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 60M3747
Product Name Insulator; Insulator Body Material Boyd
Dielectric Strength 16942 kV/in (6670 kV/cm)
Unlock Full Specs
to access all available technical data

Similar Products

Form-In-Place Gap Filler - SARCON® SPG-70A - Fujipoly® America Corp.
Specs
Form / Shape Grease, Paste; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Industry Electronics
View Details
Potting Compound Solutions for PCBAs - Electrolube ® ER2188 General Purpose Epoxy Compound - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Two Component  
Chemical System Epoxy
Industry Electronics; Semiconductors, IC's
View Details
Low thermal resistance double component CPU heat conductive gel - SE100 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Gel
Chemical System Silicone
Industry Electronics
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details