Boyd Insulator; Insulator Body Material Boyd 5300AC 1.500G

Description
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes
Datasheet
Description
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Insulator; Insulator Body Material Boyd - 60M3747 - Newark, An Avnet Company
Chicago, IL, United States
Insulator; Insulator Body Material Boyd
60M3747
Insulator; Insulator Body Material Boyd 60M3747
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes

INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm-cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 60M3747
Product Name Insulator; Insulator Body Material Boyd
Dielectric Strength 16942 kV/in (6670 kV/cm)
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
High-Performance Carbon Fiber Thermal Conductive Pad for Mass Storage Devices - CSF20 - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Form / Shape Pad
Industry Electronics
Use Temperature ? to 320 F (? to 160 C)
View Details
Highly Thermally Conductive, Non-reactive Silicone-based Grease - SARCON ® SG07SL - Fujipoly® America Corp.
Specs
Form / Shape Grease, Paste
Chemical System Silicone
Industry Electronics; Semiconductors, IC's
View Details
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
Specs
Cure / Technology Two Component  ; Addition
Industry Electronics
Features Flame Retardant; UL Rating
View Details