Boyd Insulator; Insulator Body Material Boyd 5300AC 1.500G

Description
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes
  • Insulator; Insulator Body Material Boyd - 60M3747 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Insulator; Insulator Body Material Boyd - 60M3747 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Insulator; Insulator Body Material Boyd
60M3747
Insulator; Insulator Body Material Boyd 60M3747
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes

INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm-cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 60M3747
Product Name Insulator; Insulator Body Material Boyd
Dielectric Strength 16942 kV/in (6670 kV/cm)
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - Dissipator 745
745PT
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
Heat Transfer Compound - SnapTrace® - Thermon, Inc
Thermon, Inc
Heat Transfer Compound
SnapTrace®
Specs
Form / Shape 4ft Lengths; Gap Filler, Foam in Place Gasket
Use Temperature 14 to 450 F (-10 to 232 C)
Thermal Conductivity 34.61 to 69.23 W/m-K (20 to 40 BTU-ft/hr-ft²-F)
View Details
Non-silicone thermal pad from the manufacturer suitable for smartphones - AF300 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Non-silicone thermal pad from the manufacturer suitable for smartphones
AF300
Specs
Form / Shape Pad
Chemical System Silicone
Industry Electronics
View Details
Pedigree® - 40 VTC-40F - ELANTAS North America LLC
ELANTAS North America LLC
Pedigree®
40 VTC-40F
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details