Boyd Insulator; Insulator Body Material Boyd 5300AC 1.500G

Description
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes
Datasheet
Description
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Insulator; Insulator Body Material Boyd - 60M3747 - Newark, An Avnet Company
Chicago, IL, United States
Insulator; Insulator Body Material Boyd
60M3747
Insulator; Insulator Body Material Boyd 60M3747
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes

INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:-; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm-cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 60M3747
Product Name Insulator; Insulator Body Material Boyd
Dielectric Strength 16942 kV/in (6670 kV/cm)
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
High-Reliability Thermoplastic Adhesives for Microelectronics - STAYSTIK ® 571 - MacDermid Alpha Electronics Solutions
Specs
Cure / Technology Thermoplastic / Hot Melt; Thermoset
Industry Electronics; Semiconductors, IC's
View Details
Pedigree® - 40 VTC-40F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
High Thermally Conductive and Non-Flammable Silicone Gel Sheet - SARCON ® XR-e - Fujipoly® America Corp.
Specs
Form / Shape Gel; Pad; Gap Filler, Foam in Place Gasket
Chemical System Silicone
Gap Fill 0.0394 to 0.0787 inch (1 to 2 mm)
View Details