Boyd Insulator; Insulator Body Material Boyd 53-77-2G

Description
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:0.92W/m .K; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes
  • Insulator; Insulator Body Material Boyd - 24M0269 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:0.92W/m .K; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Insulator; Insulator Body Material Boyd - 24M0269 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Insulator; Insulator Body Material Boyd
24M0269
Insulator; Insulator Body Material Boyd 24M0269
INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:0.92W/m .K; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm- cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes

INSULATOR; Insulator Body Material:Silicone Rubber; Thermal Conductivity:0.92W/m.K; Breakdown Voltage Vbr:-; Thickness:0.152mm; Volume Resistivity:1015ohm-cm; Thermal Impedance:-; Dielectric Strength:667kV/mm; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 24M0269
Product Name Insulator; Insulator Body Material Boyd
Thermal Conductivity 0.9200 W/m-K (0.5316 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

2-Part, Silicone Potting Compound and Encapsulant, UL Listed - QSil-563 - CHT USA Inc.
CHT USA Inc.
2-Part, Silicone Potting Compound and Encapsulant, UL Listed
QSil-563
Specs
Cure / Technology Two Component  ; Addition
Industry Automotive; Electronics
Features Flame Retardant; UL Rating
View Details
Thin Film, High Thermal Conductivity - SARCON ® HR - Fujipoly® America Corp.
Fujipoly® America Corp.
Thin Film, High Thermal Conductivity
SARCON ® HR
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Gap Fill 0.0118 to 0.0335 inch (0.3000 to 0.8500 mm)
Industry Electronics; Semiconductors, IC's
View Details
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity - EP3HTSDA-1 - Master Bond, Inc.
Master Bond, Inc.
Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity
EP3HTSDA-1
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid; Die Bonding Adhesives; Gap Filler, Foam in Place Gasket
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Hernon Manufacturing, Inc.
Formulations - Applications - Thermally Conductive - Dissipator 745
745PT
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details