Boyd Thermal Insulating Film; Insulator Body Material Boyd 43-77-9G

Description
THERMAL INSULATING FILM; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:0.379W/ m.K; Breakdown Voltage Vbr:-; Thickness:0.05mm; Volume Resistivity:1017ohm- cm; Thermal Impedance:-; Dielectric Strength:4.5kV/mm RoHS Compliant: Yes
Datasheet
Description
THERMAL INSULATING FILM; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:0.379W/ m.K; Breakdown Voltage Vbr:-; Thickness:0.05mm; Volume Resistivity:1017ohm- cm; Thermal Impedance:-; Dielectric Strength:4.5kV/mm RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Insulating Film; Insulator Body Material Boyd - 83K3539 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Insulating Film; Insulator Body Material Boyd
83K3539
Thermal Insulating Film; Insulator Body Material Boyd 83K3539
THERMAL INSULATING FILM; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:0.379W/ m.K; Breakdown Voltage Vbr:-; Thickness:0.05mm; Volume Resistivity:1017ohm- cm; Thermal Impedance:-; Dielectric Strength:4.5kV/mm RoHS Compliant: Yes

THERMAL INSULATING FILM; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:0.379W/m.K; Breakdown Voltage Vbr:-; Thickness:0.05mm; Volume Resistivity:1017ohm-cm; Thermal Impedance:-; Dielectric Strength:4.5kV/mm RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 83K3539
Product Name Thermal Insulating Film; Insulator Body Material Boyd
Thermal Conductivity 0.3790 W/m-K (0.2190 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Ripley™ - E 468-2-7-55F - ELANTAS North America LLC
ELANTAS North America LLC
Specs
Type High Dielectric
Cure / Technology Thermoset; Single Component
Form / Shape Liquid
View Details
Heat Transfer Compound - T-85 - Thermon, Inc
Specs
Cure / Technology Single Component
Form / Shape Die Bonding Adhesives; Grease, Paste
Use Temperature 32 to 450 F (0 to 232 C)
View Details
Thermal Interface Materials -  - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
ATROX ® 558-2C31 -  - MacDermid Alpha Electronics Solutions
MacDermid Alpha Electronics Solutions
Specs
Form / Shape Die Bonding Adhesives
Industry Electronics; Semiconductors, IC's
Features Electrically Conductive
View Details