Boyd Thermal Pad, 19.3Mm X 13.97Mm, To-220; Thickness Boyd 4170G

Description
THERMAL PAD, 19.3Mm x 13.97MM, TO-220; Thickness:1.78mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:-; Volume Resistivity:-; External Length:19.3mm; External Width:13.97mm; Product Range:- RoHS Compliant: Yes
Datasheet
Description
THERMAL PAD, 19.3Mm x 13.97MM, TO-220; Thickness:1.78mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:-; Volume Resistivity:-; External Length:19.3mm; External Width:13.97mm; Product Range:- RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Thermal Pad, 19.3Mm X 13.97Mm, To-220; Thickness Boyd - 10M5994 - Newark, An Avnet Company
Chicago, IL, United States
Thermal Pad, 19.3Mm X 13.97Mm, To-220; Thickness Boyd
10M5994
Thermal Pad, 19.3Mm X 13.97Mm, To-220; Thickness Boyd 10M5994
THERMAL PAD, 19.3Mm x 13.97MM, TO-220; Thickness:1.78mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:-; Volume Resistivity:-; External Length:19.3mm; External Width:13.97mm; Product Range:- RoHS Compliant: Yes

THERMAL PAD, 19.3Mm x 13.97MM, TO-220; Thickness:1.78mm; Conductive Material:Aluminium Oxide Ceramic; Thermal Conductivity:-; Thermal Impedance:-; Volume Resistivity:-; External Length:19.3mm; External Width:13.97mm; Product Range:- RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 10M5994
Product Name Thermal Pad, 19.3Mm X 13.97Mm, To-220; Thickness Boyd
Unlock Full Specs
to access all available technical data

Similar Products

Flexible thermal conductive insulating film for power semiconductors - SC1000FG - Dongguan Sheen Electronic Technology Co., Ltd.
Specs
Chemical System Silicone
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Formulations - Applications - Thermally Conductive - Dissipator 745 - 745PT - Hernon Manufacturing, Inc.
Specs
Cure / Technology Room Temperature Vulcanizing or Curing
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
High Tensile Strength Epoxy Adhesive Utilizes Renewable Biomaterial - EP70CN - Master Bond, Inc.
Specs
Type High Dielectric; Optical
Cure / Technology Thermoset; Two Component  ; Room Temperature Vulcanizing or Curing
Form / Shape Liquid; Die Bonding Adhesives; Encapsulant or Conformal Coating; Gap Filler, Foam in Place Gasket
View Details
Thermal Pads - 1225189 - RS Components, Ltd.
RS Components, Ltd.
Specs
Thermal Conductivity 5 W/m-K (2.89 BTU-ft/hr-ft²-F)
View Details