Manufacturer: NXP USA Inc.
Win Source Part Number: 813467-MPC8313ZQAFFC
Packaging: Tray
Part Status: Last Time Buy
Supplier Device Package: 516-TEPBGA (27x27)
Manufacturer Package: 516-BBGA Exposed Pad
Popularity: Low
Fake Threat In the Open Market: 59 pct.
Supply and Demand Status: Limited
Manufacturer Pack Quantity: 40
MSL Level: 3 (168 Hours)
Part Number Series: MPC8313
IC MPU POWERQUICC II PRO 516PBGA
POWERQUICC 32 BIT POWER ARCHITEC
IC MPU POWERQUICC II PRO 516PBGA
Microprocessor IC * 516-TEPBGA (27x27)
| Win Source Electronics | DigiKey | Shenzhen Shengyu Electronics Technology Limited | Lingto Electronic Limited | Quarktwin Technology Ltd. | Quarktwin Technology Ltd. | |
|---|---|---|---|---|---|---|
| Product Category | Microprocessor Chips (MPU) | Microprocessor Chips (MPU) | Microprocessor Chips (MPU) | Microprocessor Chips (MPU) | Microprocessor Chips (MPU) | Microprocessor Chips (MPU) |
| Product Number | 813467-MPC8313ZQAFFC | MPC8313ZQAFFC-ND | MPC8313ZQAFFC | MPC8313ZQAFFC | MPC8313ZQAFFC | MPC8313ZQAFFC |
| Product Name | Embedded - Embedded - Microprocessors - MPC8313ZQAFFC | Microprocessors | Integrated Circuits (ICs) - Embedded - Microprocessors | Embedded - Microprocessors | Microprocessors | Microprocessors |
| Package Type | Other; 516-BBGA Exposed Pad | BGA; Other; 516-BBGA Exposed Pad |
