ATP Electronics, Inc. Integrated Circuits (ICs) - Memory - Memory AF021GEC5A-2004IX

Description
21GB E.MMC 153 BALLS I-TEMP BGA
Datasheet
Description
21GB E.MMC 153 BALLS I-TEMP BGA
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Memory - Memory - AF021GEC5A-2004IX - Acme Chip Technology Co., Limited
Shenzhen, China
Integrated Circuits (ICs) - Memory - Memory
AF021GEC5A-2004IX
Integrated Circuits (ICs) - Memory - Memory AF021GEC5A-2004IX
21GB E.MMC 153 BALLS I-TEMP BGA

21GB E.MMC 153 BALLS I-TEMP BGA

Supplier's Site
Memory - AF021GEC5A-2004IX - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
Memory IC

Memory IC

Buy Now Datasheet

Technical Specifications

  Acme Chip Technology Co., Limited Quarktwin Technology Ltd.
Product Category Memory Chips Memory Chips
Product Number AF021GEC5A-2004IX AF021GEC5A-2004IX
Product Name Integrated Circuits (ICs) - Memory - Memory Memory
Unlock Full Specs
to access all available technical data

Similar Products

SDRAM - 2420777 - RS Components, Ltd.
RS Components, Ltd.
Specs
Memory Category DRAM Chip
Access Time 0.4000 ns
Number of Words 64000 k
View Details
 - 27C128-30MD - Rochester Electronics
Rochester Electronics
Specs
Memory Category EPROM
Package Type DIP; SBCDIP
View Details
4 suppliers
Memory - AS8F128K32 - Micross Components, Inc.
Micross Components, Inc.
Specs
Memory Category FLASH
Access Time 60 to 150 ns
Operating Temperature -55 to 125 C (-67 to 257 F)
View Details