This specification covers twelve grades of thermosetting laminate with copper foil cladded to one or both surfaces. These combination forms are intended primarily for use in fabrication of printed (etched) wiring or circuit boards. The laminates shall meet the following requirements: peel strength after solder float and at elevated temperature conditions; lengthwise and crosswise flexural strengths; flammability rating; water absorption; volume resistivity; dielectric breakdown parallel to laminations; dissipation factor; and permittivity. Warp or twist, and blistering requirements shall also be tested for conformance.
| ASTM International | |
|---|---|
| Product Category | Standards and Technical Documents |
| Product Number | ASTM D1867-13 |
| Product Name | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring (Withdrawn 2020) |
