Richardson RFPD RF Relay S172D-26

Description
The S172 surface mount Centigrid® relay is an ultraminiature, hermetically sealed, armature relay for commercial applications. Its low profile height (0.470) and 0.100"" grid spaced terminals make it an ideal choice where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for all types of surfacemount solder reflow processes. The basic design and internal structure are similar to Teledyne's DPDT 114 Centigrid® relay. The S172D relay has an internal discrete silicon diode for coil transient suppression.
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Description
The S172 surface mount Centigrid® relay is an ultraminiature, hermetically sealed, armature relay for commercial applications. Its low profile height (0.470) and 0.100"" grid spaced terminals make it an ideal choice where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for all types of surfacemount solder reflow processes. The basic design and internal structure are similar to Teledyne's DPDT 114 Centigrid® relay. The S172D relay has an internal discrete silicon diode for coil transient suppression.
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Suppliers

Company
Product
Description
Supplier Links
RF Relay - S172D-26 - Richardson RFPD
Downers Grove, IL, United States
RF Relay
S172D-26
RF Relay S172D-26
The S172 surface mount Centigrid® relay is an ultraminiature, hermetically sealed, armature relay for commercial applications. Its low profile height (0.470) and 0.100"" grid spaced terminals make it an ideal choice where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for all types of surfacemount solder reflow processes. The basic design and internal structure are similar to Teledyne's DPDT 114 Centigrid® relay. The S172D relay has an internal discrete silicon diode for coil transient suppression.

The S172 surface mount Centigrid® relay is an ultraminiature, hermetically sealed, armature relay for commercial applications. Its low profile height (0.470) and 0.100"" grid spaced terminals make it an ideal choice where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for all types of surfacemount solder reflow processes. The basic design and internal structure are similar to Teledyne's DPDT 114 Centigrid® relay. The S172D relay has an internal discrete silicon diode for coil transient suppression.

Supplier's Site

Technical Specifications

  Richardson RFPD
Product Category Electromechanical Relays
Product Number S172D-26
Product Name RF Relay
Mounting Centigrid, SMT
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