The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is reduced from about 150°C/watt to 22°C/watt.
| Richardson RFPD | |
|---|---|
| Product Category | Heat Sinks |
| Product Number | 258 |
| Product Name | Board Level Heat Sink |
| H | 12.7 mm (0.5000 inch) |
