Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers component thermal specifications.
| Richardson RFPD | |
|---|---|
| Product Category | Heat Sinks |
| Product Number | 217-36CTRE6 |
| Product Name | Board Level Heat Sink |
| H | 9.14 mm (0.3600 inch) |
