Amphenol Aerospace Corporation UHD Series

Amphenol's wide range of board level interconnects also includes high density UHD (Ultra High Density) Series module and backplane connectors. These utilize fork and blade contacts in a staggered grid pattern for attachment to printed circuit boards. The taggered pattern is 80 contacts per inch, .025 pitch in 8 rows. They are SEM-E format and are qualified to: EIA 15-763, DESC 89065, IEEE 1101.1 to 1101.9. SU configurations are also available. The UHD module connectors have surface mount blade contacts and the mating UHD backplane connectors have solderless compliant press-fit tuning fork contacts. There are a wide range of high contact density patterns and the length and style can be tailored to meet customer requirements. They are rigid pin terminated to the board or flex terminated to the board. Coax, fiber optics and power contacts can also be integrated into the connector configuration. Other options include EMI shielding and UHD interconnects can be provided in a stacking configuration. Module covers can be integrated into the connector system. Extender board connector configurations are also available so that customers can have access to probe and test modules that are electrically connected to the backplane.