Amphenol PCD High Density Interconnect System SMASH Series

Advanced SEM E modular connector The SMASH connector offers extremely high robustness where signal integrity is required. Based on an aluminum shell with 1, 2 or 3 bays, the SMASH connector can house up to 450 contacts, with up to 150 contacts per bay. The chevron grid pattern (1.905 x 1.905 [.075 x .075]) provides high contact density for advanced electronics packaging. The metallic shell is equipped with grounding, guide pins, and keying devices to ensure mechanical reliability. The modularity Within the standard SEM E form factor, the SMASH connector provides a wide array of signal transmission combinations. Various inserts can be housed within the robust, modular shell while meeting the standard board and chassis formats. A connector that is adaptable to all types of mounting and soldering processes The sculptured flex circuit termination of the daughter card connector can accept the thickest boards. No tooling is required as the design provides good alignment to the solder pads of the daughter card. A connector dedicated to harsh environment The Starclip technology of the socket contact (with a 6 tine clip) offers high mechanical and electrical reliability, combined with low insertion force. The SMASH connector is ruggedized to meet extreme conditions such as salt spray, vibration, and contact resistance. Flexibility From 1 to 3 bays with 150 or 132 signal contacts per bay, the SMASH connector is available in either chevron grid or staggered grid patterns. It can provide RF, power, and fiber optic solutions with hybrid arrangements. LVDS signals are also available.