Amphenol Corporation Integrated Circuits (ICs) - Interface - Telecom 48236-000LF

Description
Alternative Parts (Cross-Reference): Cross Manufacturer: AMIS Category: Integrated Circuits (ICs)>Interface>Tele com Package: 10-TFDFN Exposed Pad, 10-MLF Product Status: Obsolete Pin or Socket: Socket Contact Termination: Solder, PCB Contact Finish: Tin Contact Finish Thickness: 100μin (2.54μm)
  • Integrated Circuits (ICs) - Interface - Telecom - Win Source Electronics
    Win Source Electronics
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Description
Alternative Parts (Cross-Reference): Cross Manufacturer: AMIS Category: Integrated Circuits (ICs)>Interface>Tele com Package: 10-TFDFN Exposed Pad, 10-MLF Product Status: Obsolete Pin or Socket: Socket Contact Termination: Solder, PCB Contact Finish: Tin Contact Finish Thickness: 100μin (2.54μm)
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Integrated Circuits (ICs) - Interface - Telecom - - Win Source Electronics
Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Interface - Telecom
Integrated Circuits (ICs) - Interface - Telecom
Alternative Parts (Cross-Reference): Cross Manufacturer: AMIS Category: Integrated Circuits (ICs)>Interface>Tele com Package: 10-TFDFN Exposed Pad, 10-MLF Product Status: Obsolete Pin or Socket: Socket Contact Termination: Solder, PCB Contact Finish: Tin Contact Finish Thickness: 100μin (2.54μm)

Alternative Parts (Cross-Reference): Cross
Manufacturer: AMIS
Category: Integrated Circuits (ICs)>Interface>Telecom
Package: 10-TFDFN Exposed Pad, 10-MLF
Product Status: Obsolete
Pin or Socket: Socket
Contact Termination: Solder, PCB
Contact Finish: Tin
Contact Finish Thickness: 100μin (2.54μm)

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Technical Specifications

  Win Source Electronics
Product Category IC Interfaces
Product Name Integrated Circuits (ICs) - Interface - Telecom
Device Type Sensor Interface
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