AMEC Thermasol Filler Pad, Silicone Free, 2W/mk, 1.0Mm; Insulator Body Material Amec Thermasol MSFP200-1.0

Description
FILLER PAD, SILICONE FREE, 2W/MK, 1.0MM; Insulator Body Material:-; Thermal Conductivity:2W/m.K; Breakdown Voltage Vbr:7kV; Thickness:1mm; Volume Resistivity:10000000 0000ohm-cm; Thermal Impedance:-; Dielectric Strength:14kV/mm; RoHS Compliant: Yes
  • Filler Pad, Silicone Free, 2W/mk, 1.0Mm; Insulator Body Material Amec Thermasol - 63W4091 - Newark, An Avnet Company
    Newark, An Avnet Company
Datasheet
Description
FILLER PAD, SILICONE FREE, 2W/MK, 1.0MM; Insulator Body Material:-; Thermal Conductivity:2W/m.K; Breakdown Voltage Vbr:7kV; Thickness:1mm; Volume Resistivity:10000000 0000ohm-cm; Thermal Impedance:-; Dielectric Strength:14kV/mm; RoHS Compliant: Yes
Datasheet

Suppliers

Company
Product
Description
Supplier Links
Filler Pad, Silicone Free, 2W/mk, 1.0Mm; Insulator Body Material Amec Thermasol - 63W4091 - Newark, An Avnet Company
Newark, An Avnet Company
Chicago, IL, United States
Filler Pad, Silicone Free, 2W/mk, 1.0Mm; Insulator Body Material Amec Thermasol
63W4091
Filler Pad, Silicone Free, 2W/mk, 1.0Mm; Insulator Body Material Amec Thermasol 63W4091
FILLER PAD, SILICONE FREE, 2W/MK, 1.0MM; Insulator Body Material:-; Thermal Conductivity:2W/m.K; Breakdown Voltage Vbr:7kV; Thickness:1mm; Volume Resistivity:10000000 0000ohm-cm; Thermal Impedance:-; Dielectric Strength:14kV/mm; RoHS Compliant: Yes

FILLER PAD, SILICONE FREE, 2W/MK, 1.0MM; Insulator Body Material:-; Thermal Conductivity:2W/m.K; Breakdown Voltage Vbr:7kV; Thickness:1mm; Volume Resistivity:100000000000ohm-cm; Thermal Impedance:-; Dielectric Strength:14kV/mm; RoHS Compliant: Yes

Supplier's Site Datasheet

Technical Specifications

  Newark, An Avnet Company
Product Category Thermal Compounds and Thermal Interface Materials
Product Number 63W4091
Product Name Filler Pad, Silicone Free, 2W/mk, 1.0Mm; Insulator Body Material Amec Thermasol
Thermal Conductivity 2 W/m-K (1.16 BTU-ft/hr-ft²-F)
Unlock Full Specs
to access all available technical data

Similar Products

Thermal Interface Materials - - Quantaflex Printed Electronics Inc.
Quantaflex Printed Electronics Inc.
Thermal Interface Materials
Specs
Form / Shape Liquid; Foam; Gap Filler, Foam in Place Gasket
Industry Electronics; Semiconductors, IC's
Features EMI/RFI Shielding
View Details
Thermal conductive gel pad for mobile phone smartphone - SF400 - Dongguan Sheen Electronic Technology Co., Ltd.
Dongguan Sheen Electronic Technology Co., Ltd.
Thermal conductive gel pad for mobile phone smartphone
SF400
Specs
Form / Shape Pad
Industry Electronics
Use Temperature -58 to 392 F (-50 to 200 C)
View Details
Highly Thermal Conductive, Electricity Insulative, Low Viscosity Type Silicone Compound - SARCON ® SPG-20B - Fujipoly® America Corp.
Fujipoly® America Corp.
Highly Thermal Conductive, Electricity Insulative, Low Viscosity Type Silicone Compound
SARCON ® SPG-20B
Specs
Form / Shape Gap Filler, Foam in Place Gasket
Chemical System Silicone
Industry Electronics; Semiconductors, IC's
View Details
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed - SE3000 - CHT USA Inc.
CHT USA Inc.
2-Part, Thermally Conductive Silicone Encapsulants, UL Listed
SE3000
Specs
Cure / Technology Two Component  ; Addition
Industry Electronics
Features Flame Retardant; UL Rating
View Details