Fujipoly® introduces Sarcon® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m°K.
Sarcon® PG45A requires very low compression force at high compression rates making it a great choice for applications that have delicate or wide-variation component heights requiring material compression up to 70-90%.
PG45A is available in three sheet thicknesses (1.5, 2.0, and 2.5mm) up to a maximum dimension of 300mm x 200mm. Sarcon® PG45A can also be ordered in die-cut form to fit almost any application shape and is well-suited for environments with operating temperatures ranging from -40 to +150°C.
| Fujipoly® America Corp. | |
|---|---|
| Product Category | Industrial Sealants |
| Product Number | SARCON® PG45A |
| Product Name | Extremely Compressible Thermal Gap Filler |
| Chemical System | Silicone |
| Features | Gap Filler, Foam in Place Gasket; Thermally Conductive |
| Industry | Electronics; Semiconductors, IC's |
| Gap Fill | 0.0591 to 0.0984 inch (1.5 to 2.5 mm) |
