ELANTAS North America LLC ELANTAS PDG CONACURE EA-87 Epoxy Encapsulant Catalyst 5 gal Pail EA-87 5-GAL

Description
ELANTAS PDG CONACURE EA-87 Curative Light Amber is heating curing, has a 90 minute handling time, little flexibility, and low viscosity. It offers low exotherm, electrical properties, low shrinkage, and is more cost efficient than EA-87. 5 gal Pail.
Request a Quote Datasheet
Description
ELANTAS PDG CONACURE EA-87 Curative Light Amber is heating curing, has a 90 minute handling time, little flexibility, and low viscosity. It offers low exotherm, electrical properties, low shrinkage, and is more cost efficient than EA-87. 5 gal Pail.
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
ELANTAS PDG CONACURE EA-87 Epoxy Encapsulant Catalyst 5 gal Pail - EA-87 5-GAL - Ellsworth Adhesives
Germantown, WI, USA
ELANTAS PDG CONACURE EA-87 Epoxy Encapsulant Catalyst 5 gal Pail
EA-87 5-GAL
ELANTAS PDG CONACURE EA-87 Epoxy Encapsulant Catalyst 5 gal Pail EA-87 5-GAL
ELANTAS PDG CONACURE EA-87 Curative Light Amber is heating curing, has a 90 minute handling time, little flexibility, and low viscosity. It offers low exotherm, electrical properties, low shrinkage, and is more cost efficient than EA-87. 5 gal Pail.

ELANTAS PDG CONACURE EA-87 Curative Light Amber is heating curing, has a 90 minute handling time, little flexibility, and low viscosity. It offers low exotherm, electrical properties, low shrinkage, and is more cost efficient than EA-87. 5 gal Pail.

Supplier's Site Datasheet

Technical Specifications

  Ellsworth Adhesives
Product Category Encapsulants and Potting Compounds
Product Number EA-87 5-GAL
Product Name ELANTAS PDG CONACURE EA-87 Epoxy Encapsulant Catalyst 5 gal Pail
Chemical System Epoxy
Unlock Full Specs
to access all available technical data

Similar Products

Formulations - Applications - Bonding - Tuffbond 304 - 3304AB46 - Hernon Manufacturing, Inc.
Specs
Form / Function 20 gm
Chemical System Ceramic; Epoxy
Industry Aerospace; Automotive; Electronics; Electric Power; Military; OEM or Industrial
View Details
One Part Epoxy Adhesive for Underfill Applications - EP3UF - Master Bond, Inc.
Specs
Type High Dielectric; Thermally Conductive
Form / Function Gap Filler, Foam in Place Gasket
Cure / Technology Thermoset; Single Component; Reactive or Moisture Cured
View Details
Light-Curable Materials, Encapsulating, 9201-W -  - Dymax
Specs
Form / Function Gel
Cure / Technology UV or Radiation Cured
Industry encapsulating wire bonds, chip-on-board, or chip-on-flex circuits
View Details
Potting Compounds - 2600916 - RS Components, Ltd.
RS Components, Ltd.
Specs
Form / Function Pack; Liquid
Thermal Conductivity 0.4500 W/m-K (0.2600 BTU-ft/hr-ft²-F)
View Details