Manufacturer: Alliance Memory, Inc.
Win Source Part Number: 911730-AS4C64M16D3B-
Operating Temperature Range: 0°C ~ 95°C (TC)
Features: SDRAM - DDR3 Memory IC 1Gb (64M x 16) Parallel 96-FBGA (9x13)
Package: 96-TFBGA
Package: Tray
Mounting: Surface Mount
Family Name: AS4C64
Categories: Integrated Circuits (ICs)
Case / Package: 96-FBGA (9x13)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 41 pct.
Supply and Demand Status: Balance
Quantity per package: 190
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 3 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0032
IC DRAM 1GBIT PARALLEL 96FBGA Product overview: AS4C64M16D3B-12BCN from Alliance Memory, Inc. is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-AS4C64M16D3B-12B
SDRAM - DDR3 Memory IC 1Gb (64M x 16) Parallel 800MHz 20ns 96-FBGA (9x13)
SDRAM - DDR3 Memory IC 1Gbit Parallel 800 MHz 20 ns 96-FBGA (9x13)
IC DRAM 1GBIT PARALLEL 96FBGA
IC DRAM 1GBIT PARALLEL 96FBGA
IC DRAM 1GBIT PARALLEL 96FBGA
| Win Source Electronics | ERSAELECTRONICS PTE. LTD. | DigiKey | Quarktwin Technology Ltd. | Lingto Electronic Limited | Shenzhen Shengyu Electronics Technology Limited | ODG (Origin Data Global) | |
|---|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 911730-AS4C64M16D3B-12BCN | 774-AS4C64M16D3B-12BCN | AS4C64M16D3B-12BCN-ND | AS4C64M16D3B-12BCN | AS4C64M16D3B-12BCN | AS4C64M16D3B-12BCN | AS4C64M16D3B-12BCN |
| Product Name | Memory - SDRAM - AS4C64M16D3B-12BCN | Memory IC and Storage Component | Memory | Memory | Memory | Integrated Circuits (ICs) - Memory | Memory |
| Memory Category | DRAM Chip | Volatile; DRAM Chip | DRAM Chip | DRAM; DRAM Chip | DRAM; DRAM Chip | Volatile; DRAM Chip | SDRAM - DDR3; DRAM Chip |
| Operating Temperature | 0 to 95 C (32 to 203 F) | 0 to 95 C (32 to 203 F) | 0 to 95 C (32 to 203 F) | 0 to 95 C (32 to 203 F) | 0 to 95 C (32 to 203 F) | 0 to 95 C (32 to 203 F) | |
| Package Type | BGA; 96-FBGA (9x13) | BGA; Tray | 96-TFBGA | BGA; 96-TFBGA | BGA | 96-TFBGA | |
| Access Time | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | ||
| Cycle Time | 15 ns |
