Manufacturer: Alliance Memory, Inc.
Win Source Part Number: 911721-AS4C2M32S-6BI
Operating Temperature Range: -40°C ~ 85°C (TA)
Features: SDRAM Memory IC 64Mb (2M x 32) Parallel 90-TFBGA (8x13)
Package: 90-TFBGA
Package: Tray
Mounting: Surface Mount
Family Name: AS4C2M32
Categories: Integrated Circuits (ICs)
Case / Package: 90-TFBGA (8x13)
ECCN: 3A991B2A
Popularity: High
Fake Threat In the Open Market: 57 pct.
Supply and Demand Status: Balance
Quantity per package: 190
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 19 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0002
Other Part Number: 1450-1147, AS4C2M32S-6BIN-ND
SDRAM Memory IC 64Mbit Parallel 166 MHz 5.4 ns 90-TFBGA (8x13)
IC DRAM 64MBIT PARALLEL 90TFBGA
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We are an innovative company who is dedicated to collaborating with customers and partners to develop and produce solutions that reduce your cost.
With innovativeness, a clear commitment to quality, and extensive technological expertise we work side by side with our customers along the entire value-creation chain,supporting them as an expert partner in development and solution creation.
IC DRAM 64MBIT PARALLEL 90TFBGA
| Win Source Electronics | Quarktwin Technology Ltd. | Shenzhen Shengyu Electronics Technology Limited | Karl Kruse GmbH & Co. KG | Lingto Electronic Limited | |
|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 911721-AS4C2M32S-6BIN | AS4C2M32S-6BIN | AS4C2M32S-6BIN | AS4C2M32S-6BIN | AS4C2M32S-6BIN |
| Product Name | Memory - SDRAM - AS4C2M32S-6BIN | Memory | Integrated Circuits (ICs) - Memory | SDRAM,64M,3.3V,166MHz,2M x 32,90ball BGA | Memory |
| Memory Category | DRAM Chip | DRAM; DRAM Chip | Volatile; DRAM Chip | DRAM Chip | DRAM; DRAM Chip |
| Operating Temperature | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | ||
| Package Type | BGA; 90-TFBGA (8x13) | BGA; 90-TFBGA | BGA | 90ball BGA | |
| Access Time | 5.4 ns | 5.4 ns | 5.4 ns |