Manufacturer: Alliance Memory, Inc.
Win Source Part Number: 911721-AS4C2M32S-6BI
Operating Temperature Range: -40°C ~ 85°C (TA)
Features: SDRAM Memory IC 64Mb (2M x 32) Parallel 90-TFBGA (8x13)
Package: 90-TFBGA
Package: Tray
Mounting: Surface Mount
Family Name: AS4C2M32
Categories: Integrated Circuits (ICs)
Case / Package: 90-TFBGA (8x13)
ECCN: 3A991B2A
Popularity: High
Fake Threat In the Open Market: 57 pct.
Supply and Demand Status: Balance
Quantity per package: 190
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 19 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0002
Other Part Number: 1450-1147, AS4C2M32S-6BIN-ND
IC DRAM 64MBIT PARALLEL 90TFBGA Product overview: AS4C2M32S-6BIN from Alliance Memory, Inc. is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is useful for engineers and buyers comparing datasheets, replacement parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include key electrical ratings, package details, and application requirements. Search-friendly keywords include memory IC, Flash, SRAM, DRAM, storage module, Memory IC and Storage Component, Memory ICs Products. This listing supports clearer product discovery for industrial, commercial, repair, automation, power, sensing, and embedded system projects. Product number 774-AS4C2M32S-6BIN can be used for catalog matching and distributor lookup.
IC DRAM 64MBIT PARALLEL 90TFBGA
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We are an innovative company who is dedicated to collaborating with customers and partners to develop and produce solutions that reduce your cost.
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SDRAM Memory IC 64Mbit Parallel 166 MHz 5.4 ns 90-TFBGA (8x13)
IC DRAM 64MBIT PARALLEL 90TFBGA
| Win Source Electronics | ERSAELECTRONICS PTE. LTD. | Lingto Electronic Limited | Karl Kruse GmbH & Co. KG | Quarktwin Technology Ltd. | Shenzhen Shengyu Electronics Technology Limited | |
|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 911721-AS4C2M32S-6BIN | 774-AS4C2M32S-6BIN | AS4C2M32S-6BIN | AS4C2M32S-6BIN | AS4C2M32S-6BIN | AS4C2M32S-6BIN |
| Product Name | Memory - SDRAM - AS4C2M32S-6BIN | Memory IC and Storage Component | Memory | SDRAM,64M,3.3V,166MHz,2M x 32,90ball BGA | Memory | Integrated Circuits (ICs) - Memory |
| Memory Category | DRAM Chip | Volatile; DRAM Chip | DRAM; DRAM Chip | DRAM Chip | DRAM; DRAM Chip | Volatile; DRAM Chip |
| Operating Temperature | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | -40 to 85 C (-40 to 185 F) | ||
| Package Type | BGA; 90-TFBGA (8x13) | BGA; Tray | 90ball BGA | BGA; 90-TFBGA | BGA | |
| Access Time | 5.4 ns | 5.4 ns | 5.4 ns | 5.4 ns | ||
| Cycle Time | 2 ns |
