IC DRAM 4GBIT PARALLEL 96FBGA Product overview: AS4C256M16D3LC-12BIN
IC DRAM 4GBIT PARALLEL 96FBGA
Manufacturer: Alliance Memory, Inc.
Win Source Part Number: 911720-AS4C256M16D3L
Operating Temperature Range: -40°C ~ 95°C (TC)
Features: SDRAM - DDR3L Memory IC 4Gb (256M x 16) Parallel 96-FBGA (7.5x13.5)
Package: 96-TFBGA
Package: Tray
Mounting: Surface Mount
Family Name: AS4C256
Categories: Integrated Circuits (ICs)
Case / Package: 96-FBGA (7.5x13.5)
ECCN: EAR99
Popularity: High
Fake Threat In the Open Market: 79 pct.
Supply and Demand Status: Balance
Quantity per package: 209
MSL Level: 3 (168 Hours)
Estimated Pruduction Lead Time: 7 Weeks
REACH Status: REACH Unaffected
HTSUS: 8542.32.0036
SDRAM - DDR3L Memory IC 4Gbit Parallel 800 MHz 20 ns 96-FBGA (7.5x13.5)
IC DRAM 4GBIT PARALLEL 96FBGA
IC DRAM 4GBIT PARALLEL 96FBGA
| ERSAELECTRONICS PTE. LTD. | ODG (Origin Data Global) | Win Source Electronics | Quarktwin Technology Ltd. | Lingto Electronic Limited | Shenzhen Shengyu Electronics Technology Limited | |
|---|---|---|---|---|---|---|
| Product Category | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips | Memory Chips |
| Product Number | 774-AS4C256M16D3LC-12BIN | AS4C256M16D3LC-12BIN | 911720-AS4C256M16D3LC-12BIN | AS4C256M16D3LC-12BIN | AS4C256M16D3LC-12BIN | AS4C256M16D3LC-12BIN |
| Product Name | Memory IC and Storage Component | Memory | Memory - SDRAM - AS4C256M16D3LC-12BIN | Memory | Memory | Integrated Circuits (ICs) - Memory |
| Memory Category | Volatile; DRAM Chip | SDRAM - DDR3L; DRAM Chip | DRAM Chip | DRAM; DRAM Chip | DRAM; DRAM Chip | Volatile; DRAM Chip |
| Access Time | 20 ns | 20 ns | 20 ns | 20 ns | 20 ns | |
| Cycle Time | 15 ns | |||||
| Operating Temperature | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | -40 to 95 C (-40 to 203 F) | |
| Address Bus Width | 16 bits |