Product Overview
The low-temperature, lead-free alloy in ALPHA JP-501 has a melting point of 138°C and has been successfully used with peak reflow profiles between 155°C and 190°C. The flux residue from ALPHA JP-501 is clear and colorless, and is formulated to provide high electrical reliability in a zero-halogen flux formulation.
ALPHA JP-501 offers an outstanding reflow process window across all traditional surface finishes and is rated ROL0 per IPC J-STD-004. All components used with SnBi solders must be lead-free to prevent the formation of tin/lead/bismuth intermetallics, which have a melting point under 100°C.
Product Features
Low Temperature Reflow Profiles Enable the Use of Low Tg PCBs
Excellent Deposit Consistency
Excellent deposit consistency with high process capability index across all board designs.
Reduction in Random Solderballing Levels
Excellent Pin-Test Yield for Single and Double Reflow
Available in Type 5 Powder
| MacDermid Alpha Electronics Solutions | |
|---|---|
| Product Category | Filler Alloys and Consumables |
| Product Number | ALPHA ® JP-501 |
| Product Name | Solder Paste Materials for Printed Circuit Boards (PCB) |
| Joining Process / Product Form | Braze or solder in the form of a paste.; Powder |
