MacDermid Alpha Electronics Solutions Silver Sintering Top Attach for Power Electronics ALPHA ® Argomax ® 5040 Paste

Product Overview ALPHA Argomax 5040 Paste is a silver sintering paste developed for die placement on wet paste prior to drying, followed by low-pressure sintering die attachment on copper-finished surfaces. It is formulated for printing or dot dispensing on Cu surfaces and is designed to support die placement directly on the wet paste. The resulting pure silver bond line delivers high performance and reliability with excellent thermal and electrical conductivity. Its low sintering pressure supports high-yield manufacturing.