MacDermid Alpha Electronics Solutions Solder Paste Materials for Printed Circuit Boards (PCB) ALPHA ® CVP-390V Solder Paste

Description
Product Overview ALPHA CVP-390V is a zero-halogen solder paste that offers best-in-class electrochemical reliability, even down to 0.100mm comb spacing, against the most challenging Surface Insulation Resistance (SIR) profiles. Its compatibility with Innolot and ability to maintain high electrochemical performance on dense assembly designs makes this solder paste ideal for next-generation high-reliability applications. Formulated for compatibility with finer powder types, ALPHA CVP-390V provides >2.00 CpK for transfer efficiencies between 60%-120% at area ratios as low as 0.60, under variable print process conditions, offering ultimate flexibility in manufacturing. Additionally, ALPHA CVP-390V maintains repeatable transfer efficiency on fine-feature 01005 components and excellent coalescence down to 170µm circle and square apertures. Product Features Exceptional Pin Testability to Ensure First Pass Yields Superior Electrochemical Performance on Fine Pitched Components Excellent Coalescence Down to 170 µm Apertures on High Density Assemblies Compatible with SAC305 & Innolot High Reliability Alloys
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Description
Product Overview ALPHA CVP-390V is a zero-halogen solder paste that offers best-in-class electrochemical reliability, even down to 0.100mm comb spacing, against the most challenging Surface Insulation Resistance (SIR) profiles. Its compatibility with Innolot and ability to maintain high electrochemical performance on dense assembly designs makes this solder paste ideal for next-generation high-reliability applications. Formulated for compatibility with finer powder types, ALPHA CVP-390V provides >2.00 CpK for transfer efficiencies between 60%-120% at area ratios as low as 0.60, under variable print process conditions, offering ultimate flexibility in manufacturing. Additionally, ALPHA CVP-390V maintains repeatable transfer efficiency on fine-feature 01005 components and excellent coalescence down to 170µm circle and square apertures. Product Features Exceptional Pin Testability to Ensure First Pass Yields Superior Electrochemical Performance on Fine Pitched Components Excellent Coalescence Down to 170 µm Apertures on High Density Assemblies Compatible with SAC305 & Innolot High Reliability Alloys
Request a Quote Datasheet

Suppliers

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Solder Paste Materials for Printed Circuit Boards (PCB) - ALPHA ® CVP-390V Solder Paste - MacDermid Alpha Electronics Solutions
Waterbury, CT, United States
Solder Paste Materials for Printed Circuit Boards (PCB)
ALPHA ® CVP-390V Solder Paste
Solder Paste Materials for Printed Circuit Boards (PCB) ALPHA ® CVP-390V Solder Paste
Product Overview ALPHA CVP-390V is a zero-halogen solder paste that offers best-in-class electrochemical reliability, even down to 0.100mm comb spacing, against the most challenging Surface Insulation Resistance (SIR) profiles. Its compatibility with Innolot and ability to maintain high electrochemical performance on dense assembly designs makes this solder paste ideal for next-generation high-reliability applications. Formulated for compatibility with finer powder types, ALPHA CVP-390V provides >2.00 CpK for transfer efficiencies between 60%-120% at area ratios as low as 0.60, under variable print process conditions, offering ultimate flexibility in manufacturing. Additionally, ALPHA CVP-390V maintains repeatable transfer efficiency on fine-feature 01005 components and excellent coalescence down to 170µm circle and square apertures. Product Features Exceptional Pin Testability to Ensure First Pass Yields Superior Electrochemical Performance on Fine Pitched Components Excellent Coalescence Down to 170 µm Apertures on High Density Assemblies Compatible with SAC305 & Innolot High Reliability Alloys

Product Overview

ALPHA CVP-390V is a zero-halogen solder paste that offers best-in-class electrochemical reliability, even down to 0.100mm comb spacing, against the most challenging Surface Insulation Resistance (SIR) profiles. Its compatibility with Innolot and ability to maintain high electrochemical performance on dense assembly designs makes this solder paste ideal for next-generation high-reliability applications.

Formulated for compatibility with finer powder types, ALPHA CVP-390V provides >2.00 CpK for transfer efficiencies between 60%-120% at area ratios as low as 0.60, under variable print process conditions, offering ultimate flexibility in manufacturing. Additionally, ALPHA CVP-390V maintains repeatable transfer efficiency on fine-feature 01005 components and excellent coalescence down to 170µm circle and square apertures.

Product Features

Exceptional Pin Testability to Ensure First Pass Yields


Superior Electrochemical Performance on Fine Pitched Components


Excellent Coalescence Down to 170 µm Apertures on High Density Assemblies


Compatible with SAC305 & Innolot High Reliability Alloys

Supplier's Site Datasheet

Technical Specifications

  MacDermid Alpha Electronics Solutions
Product Category Filler Alloys and Consumables
Product Number ALPHA ® CVP-390V Solder Paste
Product Name Solder Paste Materials for Printed Circuit Boards (PCB)
Joining Process / Product Form Braze or solder in the form of a paste.; Powder
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