Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU9CG-2FFVC900I

Description
Win Source Part Number: 1003130-XCZU9CG-2FFV C900I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 5A002A4 XIL Fake Threat In the Open Market: 81 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.31.0001 Mfr: AMD Xilinx Other Names: 122-2032 Base Product Number: XCZU9
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Description
Win Source Part Number: 1003130-XCZU9CG-2FFV C900I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 5A002A4 XIL Fake Threat In the Open Market: 81 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.31.0001 Mfr: AMD Xilinx Other Names: 122-2032 Base Product Number: XCZU9
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Suppliers

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Product
Description
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Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1003130-XCZU9CG-2FFVC900I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1003130-XCZU9CG-2FFVC900I
Win Source Part Number: 1003130-XCZU9CG-2FFV C900I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: -40°C ~ 100°C (TJ) ECCN: 5A002A4 XIL Fake Threat In the Open Market: 81 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.31.0001 Mfr: AMD Xilinx Other Names: 122-2032 Base Product Number: XCZU9

Win Source Part Number: 1003130-XCZU9CG-2FFVC900I
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq® UltraScale+™ MPSoC CG
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed: 533MHz, 1.3GHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 204
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 81 pct.
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.31.0001
Mfr: AMD Xilinx
Other Names: 122-2032
Base Product Number: XCZU9

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System On Chip (SoC) - XCZU9CG-2FFVC900I - ODG (Origin Data Global)
Shenzhen, China
System On Chip (SoC)
XCZU9CG-2FFVC900I
System On Chip (SoC) XCZU9CG-2FFVC900I
IC SOC CORTEX-A53 900FCBGA

IC SOC CORTEX-A53 900FCBGA

Supplier's Site Datasheet
Embedded - System On Chip (SoC) - XCZU9CG-2FFVC900I - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
XCZU9CG-2FFVC900I
Embedded - System On Chip (SoC) XCZU9CG-2FFVC900I
IC SOC CORTEX-A53 900FCBGA

IC SOC CORTEX-A53 900FCBGA

Supplier's Site Datasheet
System On Chip (SoC) - XCZU9CG-2FFVC900I - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU9CG-2FFVC900I
System On Chip (SoC) XCZU9CG-2FFVC900I
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 533MHz, 1.3GHz 900-FCBGA (31x31)

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 533MHz, 1.3GHz 900-FCBGA (31x31)

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System On Chip (SoC) - XCZU9CG-2FFVC900I - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU9CG-2FFVC900I
System On Chip (SoC) XCZU9CG-2FFVC900I
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 533MHz, 1.3GHz 900-FCBGA (31x31)

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 533MHz, 1.3GHz 900-FCBGA (31x31)

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Technical Specifications

  Win Source Electronics ODG (Origin Data Global) Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1003130-XCZU9CG-2FFVC900I XCZU9CG-2FFVC900I XCZU9CG-2FFVC900I XCZU9CG-2FFVC900I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) Embedded - System On Chip (SoC) System On Chip (SoC)
Processor Core ARM Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Package / Case Tray 900-BBGA, FCBGA
RAM Size 0.2560 MB 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 204 #
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