Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU9CG-1FFVC900I

Description
Win Source Part Number: 1030896-XCZU9CG-1FFV C900I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 500MHz, 1.2GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU9CG-1FFVC900IXCZ U9CG1FFVC900I; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 53 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.31.0001 Mfr: AMD Xilinx Base Product Number: XCZU9
Request a Quote Datasheet
Description
Win Source Part Number: 1030896-XCZU9CG-1FFV C900I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 500MHz, 1.2GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU9CG-1FFVC900IXCZ U9CG1FFVC900I; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 53 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.31.0001 Mfr: AMD Xilinx Base Product Number: XCZU9
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1030896-XCZU9CG-1FFVC900I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1030896-XCZU9CG-1FFVC900I
Win Source Part Number: 1030896-XCZU9CG-1FFV C900I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 500MHz, 1.2GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU9CG-1FFVC900IXCZ U9CG1FFVC900I; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 53 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.31.0001 Mfr: AMD Xilinx Base Product Number: XCZU9

Win Source Part Number: 1030896-XCZU9CG-1FFVC900I
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq® UltraScale+™ MPSoC CG
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed: 500MHz, 1.2GHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 204
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 599K+ Logic Cells
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
Alternative Parts (Cross-Reference): XCZU9CG-1FFVC900IXCZU9CG1FFVC900I;
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 53 pct.
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.31.0001
Mfr: AMD Xilinx
Base Product Number: XCZU9

Buy Now Datasheet
System On Chip (SoC) - XCZU9CG-1FFVC900I - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU9CG-1FFVC900I
System On Chip (SoC) XCZU9CG-1FFVC900I
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)

Buy Now
System On Chip (SoC) - XCZU9CG-1FFVC900I - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU9CG-1FFVC900I
System On Chip (SoC) XCZU9CG-1FFVC900I
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 599K+ Logic Cells 500MHz, 1.2GHz 900-FCBGA (31x31)

Buy Now
Embedded - System On Chip (SoC) - XCZU9CG-1FFVC900I - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
XCZU9CG-1FFVC900I
Embedded - System On Chip (SoC) XCZU9CG-1FFVC900I
IC SOC CORTEX-A53 900FCBGA

IC SOC CORTEX-A53 900FCBGA

Supplier's Site Datasheet
System On Chip (SoC) - XCZU9CG-1FFVC900I - ODG (Origin Data Global)
Shenzhen, China
System On Chip (SoC)
XCZU9CG-1FFVC900I
System On Chip (SoC) XCZU9CG-1FFVC900I
IC SOC CORTEX-A53 900FCBGA

IC SOC CORTEX-A53 900FCBGA

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics Quarktwin Technology Ltd. Lingto Electronic Limited ODG (Origin Data Global)
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1030896-XCZU9CG-1FFVC900I XCZU9CG-1FFVC900I XCZU9CG-1FFVC900I XCZU9CG-1FFVC900I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) Embedded - System On Chip (SoC) System On Chip (SoC)
Processor Core ARM ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Package / Case Tray 900-BBGA, FCBGA
RAM Size 0.2560 MB 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 204 #
Unlock Full Specs
to access all available technical data

Similar Products

System-On-Chips - 1697120P - RS Components, Ltd.
Nordic Semiconductor ASA
Specs
Processor Core ARM; Bluetooth Smart, 32 Bit ARM Cortex M4
Data Bus 32 Bit
Interface Bluetooth Smart, 32 Bit ARM Cortex M4
View Details
Specs
Processor Core ARM
Clock Frequency 500 MHz
RAM Size 0.5120 MB
View Details