Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU7EV-1FBVB900E

Description
Win Source Part Number: 1228808-XCZU7EV-1FBV B900E Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC EV Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Speed: 500MHz, 600MHz, 1.2GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: 0°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU7EV1FBVB900E; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 59 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU7
Request a Quote Datasheet
Description
Win Source Part Number: 1228808-XCZU7EV-1FBV B900E Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC EV Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Speed: 500MHz, 600MHz, 1.2GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: 0°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU7EV1FBVB900E; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 59 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU7
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1228808-XCZU7EV-1FBVB900E - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1228808-XCZU7EV-1FBVB900E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1228808-XCZU7EV-1FBVB900E
Win Source Part Number: 1228808-XCZU7EV-1FBV B900E Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC EV Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Speed: 500MHz, 600MHz, 1.2GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 204 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Temperature Range - Operating: 0°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU7EV1FBVB900E; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 59 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU7

Win Source Part Number: 1228808-XCZU7EV-1FBVB900E
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq® UltraScale+™ MPSoC EV
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed: 500MHz, 600MHz, 1.2GHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 204
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
Alternative Parts (Cross-Reference): XCZU7EV1FBVB900E;
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 59 pct.
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Base Product Number: XCZU7

Buy Now Datasheet

Technical Specifications

  Win Source Electronics
Product Category Programmable Logic Devices (PLD)
Product Number 1228808-XCZU7EV-1FBVB900E
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Operating Temperature 0 to 100 C (32 to 212 F)
Unlock Full Specs
to access all available technical data

Similar Products

SCAN921023 20 MHz-66MHz 10-Bit Serializer with IEEE 1149.1 Test Access - SCAN921023SLC - Texas Instruments
Specs
Device Type SERDES
Supply Voltage 3.3V
Operating Current 130 milliamps
View Details
2 suppliers
Embedded - FPGAs (Field Programmable Gate Array) - EP2A25B724C7 - Lingto Electronic Limited
Specs
Device Type FPGA
User I/Os 540 pins
View Details
Industry Pack FPGA Module - IP-EP200 - Acromag, Inc.
Specs
Device Type FPGA
Operating Temperature 0 to 70 C (32 to 158 F)
View Details
SDI Receivers & Transmitters -  - Semtech Corp.
Specs
Device Type SERDES
Power Dissipation 525 milliwatts
Package Type Other (optional feature)
View Details