Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU5EG-L2FBVB900E

Description
Win Source Part Number: 1353756-XCZU5EG-L2FB VB900E Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Temperature Range - Operating: 0°C ~ 100°C (TJ) Fake Threat In the Open Market: 45 pct. MSL Level: 4 (72 Hours) Mfr: AMD Series: Zynq® UltraScale+™ MPSoC EG Package: Tray Product Status: Not For New Designs Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Base Product Number: XCZU5 HTSUS: 8542.39.0001 REACH Status: REACH Unaffected ECCN: 5A002A4 XIL Speed: 533MHz, 600MHz, 1.3GHz Number of I/O: 204 Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
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Description
Win Source Part Number: 1353756-XCZU5EG-L2FB VB900E Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Temperature Range - Operating: 0°C ~ 100°C (TJ) Fake Threat In the Open Market: 45 pct. MSL Level: 4 (72 Hours) Mfr: AMD Series: Zynq® UltraScale+™ MPSoC EG Package: Tray Product Status: Not For New Designs Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Base Product Number: XCZU5 HTSUS: 8542.39.0001 REACH Status: REACH Unaffected ECCN: 5A002A4 XIL Speed: 533MHz, 600MHz, 1.3GHz Number of I/O: 204 Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells
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Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1353756-XCZU5EG-L2FBVB900E - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1353756-XCZU5EG-L2FBVB900E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1353756-XCZU5EG-L2FBVB900E
Win Source Part Number: 1353756-XCZU5EG-L2FB VB900E Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Temperature Range - Operating: 0°C ~ 100°C (TJ) Fake Threat In the Open Market: 45 pct. MSL Level: 4 (72 Hours) Mfr: AMD Series: Zynq® UltraScale+™ MPSoC EG Package: Tray Product Status: Not For New Designs Package / Case: 900-BBGA, FCBGA Supplier Device Package: 900-FCBGA (31x31) Base Product Number: XCZU5 HTSUS: 8542.39.0001 REACH Status: REACH Unaffected ECCN: 5A002A4 XIL Speed: 533MHz, 600MHz, 1.3GHz Number of I/O: 204 Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

Win Source Part Number: 1353756-XCZU5EG-L2FBVB900E
Category: Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
Fake Threat In the Open Market: 45 pct.
MSL Level: 4 (72 Hours)
Mfr: AMD
Series: Zynq® UltraScale+™ MPSoC EG
Package: Tray
Product Status: Not For New Designs
Package / Case: 900-BBGA, FCBGA
Supplier Device Package: 900-FCBGA (31x31)
Base Product Number: XCZU5
HTSUS: 8542.39.0001
REACH Status: REACH Unaffected
ECCN: 5A002A4 XIL
Speed: 533MHz, 600MHz, 1.3GHz
Number of I/O: 204
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Connectivity: CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 256K+ Logic Cells

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Embedded - System On Chip (SoC) - XCZU5EG-L2FBVB900E - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
XCZU5EG-L2FBVB900E
Embedded - System On Chip (SoC) XCZU5EG-L2FBVB900E
IC SOC CORTEX-A53 900FCBGA

IC SOC CORTEX-A53 900FCBGA

Supplier's Site Datasheet
System On Chip (SoC) - XCZU5EG-L2FBVB900E - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU5EG-L2FBVB900E
System On Chip (SoC) XCZU5EG-L2FBVB900E
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 533MHz, 600MHz, 1.3GHz 900-FCBGA (31x31)

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 533MHz, 600MHz, 1.3GHz 900-FCBGA (31x31)

Buy Now
System On Chip (SoC) - XCZU5EG-L2FBVB900E - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU5EG-L2FBVB900E
System On Chip (SoC) XCZU5EG-L2FBVB900E
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 533MHz, 600MHz, 1.3GHz 900-FCBGA (31x31)

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 256K+ Logic Cells 533MHz, 600MHz, 1.3GHz 900-FCBGA (31x31)

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Technical Specifications

  Win Source Electronics Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1353756-XCZU5EG-L2FBVB900E XCZU5EG-L2FBVB900E XCZU5EG-L2FBVB900E
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Embedded - System On Chip (SoC) System On Chip (SoC)
Processor Core ARM ARM; Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 ARM; Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Package / Case Tray 900-BBGA, FCBGA
RAM Size 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 204 #
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