Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU2CG-2SFVA625E

Description
Win Source Part Number: 1211551-XCZU2CG-2SFV A625E Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 180 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21) Temperature Range - Operating: 0°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU2CG2SFVA625E; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 78 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU2
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Description
Win Source Part Number: 1211551-XCZU2CG-2SFV A625E Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 180 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21) Temperature Range - Operating: 0°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU2CG2SFVA625E; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 78 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU2
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Suppliers

Company
Product
Description
Supplier Links
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1211551-XCZU2CG-2SFVA625E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1211551-XCZU2CG-2SFVA625E
Win Source Part Number: 1211551-XCZU2CG-2SFV A625E Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC CG Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ Speed: 533MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 180 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells Package / Case: 625-BFBGA, FCBGA Supplier Device Package: 625-FCBGA (21x21) Temperature Range - Operating: 0°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU2CG2SFVA625E; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 78 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU2

Win Source Part Number: 1211551-XCZU2CG-2SFVA625E
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq® UltraScale+™ MPSoC CG
Core Processor: Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Speed: 533MHz, 1.3GHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 180
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 103K+ Logic Cells
Package / Case: 625-BFBGA, FCBGA
Supplier Device Package: 625-FCBGA (21x21)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
Alternative Parts (Cross-Reference): XCZU2CG2SFVA625E;
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 78 pct.
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Base Product Number: XCZU2

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Embedded - System On Chip (SoC) - XCZU2CG-2SFVA625E - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
XCZU2CG-2SFVA625E
Embedded - System On Chip (SoC) XCZU2CG-2SFVA625E
IC SOC CORTEX-A53 625FCBGA

IC SOC CORTEX-A53 625FCBGA

Supplier's Site Datasheet
System On Chip (SoC) - XCZU2CG-2SFVA625E - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU2CG-2SFVA625E
System On Chip (SoC) XCZU2CG-2SFVA625E
Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 103K+ Logic Cells 533MHz, 1.3GHz 625-FCBGA (21x21)

Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC CG Zynq®UltraScale+™ FPGA, 103K+ Logic Cells 533MHz, 1.3GHz 625-FCBGA (21x21)

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Technical Specifications

  Win Source Electronics Lingto Electronic Limited Quarktwin Technology Ltd.
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1211551-XCZU2CG-2SFVA625E XCZU2CG-2SFVA625E XCZU2CG-2SFVA625E
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) Embedded - System On Chip (SoC) System On Chip (SoC)
Processor Core ARM ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ ARM; Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Package / Case Tray 625-BFBGA, FCBGA
RAM Size 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 180 #
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