Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XCZU11EG-2FFVC1156I

Description
Win Source Part Number: 1225188-XCZU11EG-2FF VC1156I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC EG Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Speed: 533MHz, 600MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 360 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU11EG2FFVC1156I; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 73 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU11
Request a Quote Datasheet
Description
Win Source Part Number: 1225188-XCZU11EG-2FF VC1156I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC EG Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Speed: 533MHz, 600MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 360 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU11EG2FFVC1156I; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 73 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU11
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1225188-XCZU11EG-2FFVC1156I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1225188-XCZU11EG-2FFVC1156I
Win Source Part Number: 1225188-XCZU11EG-2FF VC1156I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq® UltraScale+™ MPSoC EG Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Speed: 533MHz, 600MHz, 1.3GHz Package: Tray Standard Package: 1 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA, WDT Number of I/O: 360 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells Package / Case: 1156-BBGA, FCBGA Supplier Device Package: 1156-FCBGA (35x35) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XCZU11EG2FFVC1156I; ECCN: 5A002A4 XIL Fake Threat In the Open Market: 73 pct. MSL Level: 4 (72 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XCZU11

Win Source Part Number: 1225188-XCZU11EG-2FFVC1156I
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq® UltraScale+™ MPSoC EG
Core Processor: Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Speed: 533MHz, 600MHz, 1.3GHz
Package: Tray
Standard Package: 1
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA, WDT
Number of I/O: 360
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Zynq®UltraScale+™ FPGA, 653K+ Logic Cells
Package / Case: 1156-BBGA, FCBGA
Supplier Device Package: 1156-FCBGA (35x35)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
Alternative Parts (Cross-Reference): XCZU11EG2FFVC1156I;
ECCN: 5A002A4 XIL
Fake Threat In the Open Market: 73 pct.
MSL Level: 4 (72 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Base Product Number: XCZU11

Buy Now Datasheet
System On Chip (SoC) - XCZU11EG-2FFVC1156I - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU11EG-2FFVC1156I
System On Chip (SoC) XCZU11EG-2FFVC1156I
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)

Buy Now
System On Chip (SoC) - XCZU11EG-2FFVC1156I - Quarktwin Technology Ltd.
Shenzhen, Guangdong, China
System On Chip (SoC)
XCZU11EG-2FFVC1156I
System On Chip (SoC) XCZU11EG-2FFVC1156I
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 653K+ Logic Cells 533MHz, 600MHz, 1.3GHz 1156-FCBGA (35x35)

Buy Now
System On Chip (SoC) - XCZU11EG-2FFVC1156I - ODG (Origin Data Global)
Shenzhen, China
System On Chip (SoC)
XCZU11EG-2FFVC1156I
System On Chip (SoC) XCZU11EG-2FFVC1156I
IC SOC CORTEX-A53 1156FCBGA

IC SOC CORTEX-A53 1156FCBGA

Supplier's Site Datasheet
Embedded - System On Chip (SoC) - XCZU11EG-2FFVC1156I - Lingto Electronic Limited
Shenzhen, China
Embedded - System On Chip (SoC)
XCZU11EG-2FFVC1156I
Embedded - System On Chip (SoC) XCZU11EG-2FFVC1156I
IC SOC CORTEX-A53 1156FCBGA

IC SOC CORTEX-A53 1156FCBGA

Supplier's Site Datasheet

Technical Specifications

  Win Source Electronics Quarktwin Technology Ltd. ODG (Origin Data Global) Lingto Electronic Limited
Product Category System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC) System on a Chip (SoC)
Product Number 1225188-XCZU11EG-2FFVC1156I XCZU11EG-2FFVC1156I XCZU11EG-2FFVC1156I XCZU11EG-2FFVC1156I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC) System On Chip (SoC) System On Chip (SoC) Embedded - System On Chip (SoC)
Processor Core ARM ARM; Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 ARM; Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Package / Case Tray 1156-BBGA, FCBGA
RAM Size 0.2560 MB 0.2560 MB 0.2560 MB
Number of Inputs/Outputs 360 #
Unlock Full Specs
to access all available technical data

Similar Products

nRF9160 System-in-Package -  - Nordic Semiconductor ASA
Nordic Semiconductor ASA
Specs
Processor Core ARM
Interface UART
Clock Frequency 2200 MHz
View Details
Specs
Processor Core ARM
Clock Frequency 213 to 355 MHz
RAM Size 0.5120 MB
View Details
 - CY8C3244PVI-133 - Rochester Electronics
Infineon Technologies AG
View Details