Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XC7Z010-3CLG225E

Description
Win Source Part Number: 1011165-XC7Z010-3CLG 225E Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 866MHz Package: Tray Standard Package: 160 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 86 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Artix™-7 FPGA, 28K Logic Cells Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13) Temperature Range - Operating: 0°C ~ 100°C (TJ) ECCN: 3A991A2 Fake Threat In the Open Market: 69 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XC7Z010
  • Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1011165-XC7Z010-3CLG225E - Win Source Electronics
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Description
Win Source Part Number: 1011165-XC7Z010-3CLG 225E Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 866MHz Package: Tray Standard Package: 160 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 86 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Artix™-7 FPGA, 28K Logic Cells Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13) Temperature Range - Operating: 0°C ~ 100°C (TJ) ECCN: 3A991A2 Fake Threat In the Open Market: 69 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XC7Z010
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Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1011165-XC7Z010-3CLG225E - Win Source Electronics
Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1011165-XC7Z010-3CLG225E
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1011165-XC7Z010-3CLG225E
Win Source Part Number: 1011165-XC7Z010-3CLG 225E Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 866MHz Package: Tray Standard Package: 160 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 86 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Artix™-7 FPGA, 28K Logic Cells Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13) Temperature Range - Operating: 0°C ~ 100°C (TJ) ECCN: 3A991A2 Fake Threat In the Open Market: 69 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Base Product Number: XC7Z010

Win Source Part Number: 1011165-XC7Z010-3CLG225E
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq®-7000
Core Processor: Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 866MHz
Package: Tray
Standard Package: 160
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 86
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Artix™-7 FPGA, 28K Logic Cells
Package / Case: 225-LFBGA, CSPBGA
Supplier Device Package: 225-CSPBGA (13x13)
Temperature Range - Operating: 0°C ~ 100°C (TJ)
ECCN: 3A991A2
Fake Threat In the Open Market: 69 pct.
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Base Product Number: XC7Z010

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Technical Specifications

  Win Source Electronics
Product Category Programmable Logic Devices (PLD)
Product Number 1011165-XC7Z010-3CLG225E
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Operating Temperature 0 to 100 C (32 to 212 F)
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