Advanced Micro Devices, Inc. Integrated Circuits (ICs) - Embedded - System On Chip (SoC) XC7Z007S-2CLG225I

Description
Win Source Part Number: 1206426-XC7Z007S-2CL G225I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 766MHz Package: Tray Standard Package: 160 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 54 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XC7Z007S2CLG225I; ECCN: 3A991D Fake Threat In the Open Market: 78 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Other Names: 122-2011 Base Product Number: XC7Z007
Request a Quote Datasheet
Description
Win Source Part Number: 1206426-XC7Z007S-2CL G225I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 766MHz Package: Tray Standard Package: 160 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 54 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XC7Z007S2CLG225I; ECCN: 3A991D Fake Threat In the Open Market: 78 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Other Names: 122-2011 Base Product Number: XC7Z007
Request a Quote Datasheet

Suppliers

Company
Product
Description
Supplier Links
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) - 1206426-XC7Z007S-2CLG225I - Win Source Electronics
Laguna Hills, CA, United States
Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
1206426-XC7Z007S-2CLG225I
Integrated Circuits (ICs) - Embedded - System On Chip (SoC) 1206426-XC7Z007S-2CLG225I
Win Source Part Number: 1206426-XC7Z007S-2CL G225I Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC) Series: Zynq®-7000 Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™ Speed: 766MHz Package: Tray Standard Package: 160 Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG Peripherals: DMA Number of I/O: 54 RAM Size: 256KB Architecture: MCU, FPGA Primary Attributes: Artix™-7 FPGA, 23K Logic Cells Package / Case: 225-LFBGA, CSPBGA Supplier Device Package: 225-CSPBGA (13x13) Temperature Range - Operating: -40°C ~ 100°C (TJ) Alternative Parts (Cross-Reference): XC7Z007S2CLG225I; ECCN: 3A991D Fake Threat In the Open Market: 78 pct. MSL Level: 3 (168 Hours) REACH Status: REACH Unaffected HTSUS: 8542.39.0001 Mfr: AMD Xilinx Other Names: 122-2011 Base Product Number: XC7Z007

Win Source Part Number: 1206426-XC7Z007S-2CLG225I
Category: Integrated Circuits (ICs)>Embedded - System On Chip (SoC)
Series: Zynq®-7000
Core Processor: Single ARM® Cortex®-A9 MPCore™ with CoreSight™
Speed: 766MHz
Package: Tray
Standard Package: 160
Connectivity: CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals: DMA
Number of I/O: 54
RAM Size: 256KB
Architecture: MCU, FPGA
Primary Attributes: Artix™-7 FPGA, 23K Logic Cells
Package / Case: 225-LFBGA, CSPBGA
Supplier Device Package: 225-CSPBGA (13x13)
Temperature Range - Operating: -40°C ~ 100°C (TJ)
Alternative Parts (Cross-Reference): XC7Z007S2CLG225I;
ECCN: 3A991D
Fake Threat In the Open Market: 78 pct.
MSL Level: 3 (168 Hours)
REACH Status: REACH Unaffected
HTSUS: 8542.39.0001
Mfr: AMD Xilinx
Other Names: 122-2011
Base Product Number: XC7Z007

Buy Now Datasheet

Technical Specifications

  Win Source Electronics
Product Category Programmable Logic Devices (PLD)
Product Number 1206426-XC7Z007S-2CLG225I
Product Name Integrated Circuits (ICs) - Embedded - System On Chip (SoC)
Operating Temperature -40 to 100 C (-40 to 212 F)
Unlock Full Specs
to access all available technical data

Similar Products

Embedded - FPGAs (Field Programmable Gate Array) - EP1K10FC256-1 - Lingto Electronic Limited
Specs
Device Type FPGA
Logic Cells / Logic Blocks 576
User I/Os 136 pins
View Details
DS90UR904Q-Q1 10 - 43MHz 18 Bit Color FPD-Link II Deserializer - DS90UR904QSQ/NOPB - Texas Instruments
Specs
Device Type SERDES
Supply Voltage 1.8V
Package Type Other; WQFN
View Details
2 suppliers
Connect Tech Inc.
Specs
Device Type FPGA
Supply Voltage 5V
System Gates 500000
View Details
DIP CPLD Programmable Logic Device - 796-SLG46621V-DIP - ERSAELECTRONICS PTE. LTD.
Specs
Device Type CPLD
Package Type Other; Bulk
View Details