Manufacturer: AMD
Category: Integrated Circuits (ICs) -Embedded System On Chip (SoC)
Series: Zynq® UltraScale+™ MPSoC EV
Package: Tray
Package / Case: 900-BBGA, FCBGA
Operating Temperature: -40°C ~ 100°C (TJ)
Supplier Device Package: 900-FCBGA (31x31)
Architecture: MCU, FPGA
Number of I/O: 220
Speed: 500MHz, 600MHz, 1.2GHz
IC SOC CORTEX-A53 900FCBGA
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EV Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 500MHz, 600MHz, 1.2GHz 900-FCBGA (31x31)
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EV Zynq®UltraScale+™ FPGA, 192K+ Logic Cells 500MHz, 600MHz, 1.2GHz 900-FCBGA (31x31)
IC SOC CORTEX-A53 900FCBGA
| Win Source Electronics | Lingto Electronic Limited | Quarktwin Technology Ltd. | Shenzhen Shengyu Electronics Technology Limited | |
|---|---|---|---|---|
| Product Category | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) | System on a Chip (SoC) |
| Product Number | XAZU7EV-1FBVB900I | XAZU7EV-1FBVB900I | XAZU7EV-1FBVB900I | |
| Product Name | Integrated Circuits (ICs) -Embedded System On Chip (SoC) | Embedded - System On Chip (SoC) | System On Chip (SoC) | Integrated Circuits (ICs) - Embedded - System On Chip (SoC) |
| Package / Case | Tray | 900-BBGA, FCBGA | ||
| Number of Inputs/Outputs | 220 # | |||
| Operating Temperature | -40 to 212 F (-40 to 100 C) | -40 to 212 F (-40 to 100 C) | -40 to 212 F (-40 to 100 C) | |
| Processor Core | ARM; Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | ARM; Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | ARM |
