Advanced Interconnections Corp. Mod5 Series Flip-Top™ BGA Socket

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Mod5 Series Flip-Top™ BGA Socket -  - Advanced Interconnections Corp.
West Warwick, RI, United States
Mod5 Series Flip-Top™ BGA Socket
Mod5 Series Flip-Top™ BGA Socket
The new Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs.

The new Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs.

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Technical Specifications

  Advanced Interconnections Corp.
Product Category IC Interconnect Components
Product Name Mod5 Series Flip-Top™ BGA Socket
Mounting SMT; Solder Ball
Operating Temperature -40 to 140 C (-40 to 284 F)
Socket Type BGA
Product Type IC Socket
Contacts Pitch 0.5000 mm (0.0197 inches)
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