The new Mod5 Series Flip-Top™ BGA Socket is designed for test, debug, and validation of 0.50mm pitch BGA devices. The compact, surface mount design requires no tooling or mounting holes in the target PC board, maximizing real estate while reducing board costs.
| Advanced Interconnections Corp. | |
|---|---|
| Product Category | IC Interconnect Components |
| Product Name | Mod5 Series Flip-Top™ BGA Socket |
| Mounting | SMT; Solder Ball |
| Operating Temperature | -40 to 140 C (-40 to 284 F) |
| Socket Type | BGA |
| Product Type | IC Socket |
| Contacts Pitch | 0.5000 mm (0.0197 inches) |
