The FSB-B75H, the first 3rd Generation Intel® Core i7/i5/i3 LGA1155 socket PICMG 1.3 full-size Single Board Computer (SBC) with onboard Intel® B75H chipset. This unique combination offers the highest in performance, connectivity and cost savings. With up to 16MB of DDR3 1333/1600 system memory and onboard CFast slot, and quick access to multiple SATA storage and numerous USB connectors make the FSB-B75H a very cost effective option for a power packed PICMG 1.3 board for industrial and building automation applications.
The Intel® Core i7/i5/i3 processors bring new and powerful capability to the PICMG 1.3 full-size SBC, making it a powerful slim form-factor embedded platform for today's industrial applications that require high performance in expandable enclosures. The Intel® B75H chipset is rich in features and offers lower Cost of Ownership for system integrators. Operating temperature for FSB-B75H is 0°C to 60°C.
Applications
Network Security Factory Automation Transportation/ITS DVR/Surveilliance Telecom Application Server
Features
Intel 3rd Generation Core i7/i5/i3 LGA 1155 Processor Intel B75 Chipset Dual-Channel DDR3 DIMM Socket x 2 (up to 16GB) Intel B75 Integrated Intel HD Graphics Gigabit Ethernet x 2 SATA 6.0Gb/s x 1, SATA 3.0Gb/s x 2 (Backplane x 2), CFast x 1 COM x 2, USB 3.0 x 4, USB 2.0 x 4, LPT x 1 PICMG 1.3 ATX 2.1 Power Requirement
The FSB-B75H, the first 3rd Generation Intel® Core™ i7/i5/i3 LGA1155 socket PICMG 1.3 full-size Single Board Computer (SBC) with onboard Intel® B75H chipset. This unique combination offers the highest in performance, connectivity and cost savings. With up to 16MB of DDR3 1333/1600 system memory and onboard CFast™ slot, and quick access to multiple SATA storage and numerous USB connectors make the FSB-B75H a very cost effective option for a power packed PICMG 1.3 board for industrial and building automation applications.
The Intel® Core™ i7/i5/i3 processors bring new and powerful capability to the PICMG 1.3 full-size SBC, making it a powerful slim form-factor embedded platform for today's industrial applications that require high performance in expandable enclosures. The Intel® B75H chipset is rich in features and offers lower Cost of Ownership for system integrators. Operating temperature for FSB-B75H is 0°C to 60°C.
Applications
- Network Security
Factory Automation
Transportation/ITS
DVR/Surveilliance
Telecom
Application Server
Features
- Intel 3rd Generation Core i7/i5/i3 LGA 1155 Processor
Intel B75 Chipset
Dual-Channel DDR3 DIMM Socket x 2 (up to 16GB)
Intel B75 Integrated Intel HD Graphics
Gigabit Ethernet x 2
SATA 6.0Gb/s x 1, SATA 3.0Gb/s x 2 (Backplane x 2), CFast x 1
COM x 2, USB 3.0 x 4, USB 2.0 x 4, LPT x 1
PICMG 1.3
ATX 2.1 Power Requirement
