Ushio America, Inc. Large Field Stepper UX-5 & UX-7

Description
Ushio provides specialized steppers for cutting-edge packaging applications employed in servers and PCs, and in portable devices such as smart phones and tablet PCs. The stepper is intended for package substrates using a stage corresponding to the panel size and Ushio’s proprietary large-area projection lens technology cultivated from many years of expertise in light source and optical technology. High productivity is achieved while realizing the high resolution and overlay accuracy required for the latest packaging substrates. Component Technology – Includes the world’s best-selling super high-pressure UV lamp – Ushio’s irradiation optical system boasts a high degree of uniformity – Unrivaled large-area projector lens FEATURES & BENEFITS Proprietary TTL non-exposure wavelength alignment system When observing mask marks using Ushio’s patented “TTL non-exposure wavelength alignment” technology, exposure up to the alignment marks of the substrate is unnecessary. In addition, since work marks can be directly observed, there is no reduction in contrast due to masks, enabling accurate alignment using clear marks. Suits a variety of alignment marks “Pattern matching support” for registered patterns does not require particular alignment marks, alignment can be achieved through a variety of wiring patterns. High resolution High resolution is obtained by using Ushio’s projection lens for the “UPL series”. Line-space = 5μm design rule full-scale mass production support. Long depth of field Due to the long depth of field (±50 to ±100), even if differences in levels, warpage or unevenness in the board cause focal deviation, the pattern profile equivalent to the profile in focus is obtained. This feature is particularly effective when exposure is performed for a thick, dry film or solder resist. High-speed step-and-repeat by surface stages Precision air bearings are used to reduce friction, and a plane motor configuration is used to reduce the weight of all moving parts and increase their rigidity. As a result, it is possible to perform high-speed step-and-repeat operations. In addition, the surface stage exerts feedback control using a laser interferometer. Consequently, high-speed operations, as well as superior positioning accuracy, can be achieved. Elimination of mask damage Since this is a non-contact projection exposure system, the mask and workpiece do not come into direct contact. Accordingly, the attached resist does not damage the mask. This not only prevents wiring pattern defects but also makes it possible to use the mask semipermanently, reducing running costs. Moreover, since the mask requires no cleaning, we expect improved equipment utilization compared to close contact exposure systems. High overlay accuracy maintained despite board expansion and contraction The “auto scale function” corrects the projection magnification by automatically changing the magnification up to 0.1% according to the expansion or contraction, greatly reducing the deviation in alignment. APPLICATIONS FC-BGA FC-CSP Interposer 2.1D 2.5D Packaging Semiconductor post-processing RDL Passivation TSV TSV bottom hole Printed circuit board
  • Large Field Stepper - UX-5 & UX-7 - Ushio America, Inc.
    Ushio America, Inc.
Description
Ushio provides specialized steppers for cutting-edge packaging applications employed in servers and PCs, and in portable devices such as smart phones and tablet PCs. The stepper is intended for package substrates using a stage corresponding to the panel size and Ushio’s proprietary large-area projection lens technology cultivated from many years of expertise in light source and optical technology. High productivity is achieved while realizing the high resolution and overlay accuracy required for the latest packaging substrates. Component Technology – Includes the world’s best-selling super high-pressure UV lamp – Ushio’s irradiation optical system boasts a high degree of uniformity – Unrivaled large-area projector lens FEATURES & BENEFITS Proprietary TTL non-exposure wavelength alignment system When observing mask marks using Ushio’s patented “TTL non-exposure wavelength alignment” technology, exposure up to the alignment marks of the substrate is unnecessary. In addition, since work marks can be directly observed, there is no reduction in contrast due to masks, enabling accurate alignment using clear marks. Suits a variety of alignment marks “Pattern matching support” for registered patterns does not require particular alignment marks, alignment can be achieved through a variety of wiring patterns. High resolution High resolution is obtained by using Ushio’s projection lens for the “UPL series”. Line-space = 5μm design rule full-scale mass production support. Long depth of field Due to the long depth of field (±50 to ±100), even if differences in levels, warpage or unevenness in the board cause focal deviation, the pattern profile equivalent to the profile in focus is obtained. This feature is particularly effective when exposure is performed for a thick, dry film or solder resist. High-speed step-and-repeat by surface stages Precision air bearings are used to reduce friction, and a plane motor configuration is used to reduce the weight of all moving parts and increase their rigidity. As a result, it is possible to perform high-speed step-and-repeat operations. In addition, the surface stage exerts feedback control using a laser interferometer. Consequently, high-speed operations, as well as superior positioning accuracy, can be achieved. Elimination of mask damage Since this is a non-contact projection exposure system, the mask and workpiece do not come into direct contact. Accordingly, the attached resist does not damage the mask. This not only prevents wiring pattern defects but also makes it possible to use the mask semipermanently, reducing running costs. Moreover, since the mask requires no cleaning, we expect improved equipment utilization compared to close contact exposure systems. High overlay accuracy maintained despite board expansion and contraction The “auto scale function” corrects the projection magnification by automatically changing the magnification up to 0.1% according to the expansion or contraction, greatly reducing the deviation in alignment. APPLICATIONS FC-BGA FC-CSP Interposer 2.1D 2.5D Packaging Semiconductor post-processing RDL Passivation TSV TSV bottom hole Printed circuit board

Suppliers

Company
Product
Description
Supplier Links
Large Field Stepper - UX-5 & UX-7 - Ushio America, Inc.
Ushio America, Inc.
Cypress, CA, USA
Large Field Stepper
UX-5 & UX-7
Large Field Stepper UX-5 & UX-7
Ushio provides specialized steppers for cutting-edge packaging applications employed in servers and PCs, and in portable devices such as smart phones and tablet PCs. The stepper is intended for package substrates using a stage corresponding to the panel size and Ushio’s proprietary large-area projection lens technology cultivated from many years of expertise in light source and optical technology. High productivity is achieved while realizing the high resolution and overlay accuracy required for the latest packaging substrates. Component Technology – Includes the world’s best-selling super high-pressure UV lamp – Ushio’s irradiation optical system boasts a high degree of uniformity – Unrivaled large-area projector lens FEATURES & BENEFITS Proprietary TTL non-exposure wavelength alignment system When observing mask marks using Ushio’s patented “TTL non-exposure wavelength alignment” technology, exposure up to the alignment marks of the substrate is unnecessary. In addition, since work marks can be directly observed, there is no reduction in contrast due to masks, enabling accurate alignment using clear marks. Suits a variety of alignment marks “Pattern matching support” for registered patterns does not require particular alignment marks, alignment can be achieved through a variety of wiring patterns. High resolution High resolution is obtained by using Ushio’s projection lens for the “UPL series”. Line-space = 5μm design rule full-scale mass production support. Long depth of field Due to the long depth of field (±50 to ±100), even if differences in levels, warpage or unevenness in the board cause focal deviation, the pattern profile equivalent to the profile in focus is obtained. This feature is particularly effective when exposure is performed for a thick, dry film or solder resist. High-speed step-and-repeat by surface stages Precision air bearings are used to reduce friction, and a plane motor configuration is used to reduce the weight of all moving parts and increase their rigidity. As a result, it is possible to perform high-speed step-and-repeat operations. In addition, the surface stage exerts feedback control using a laser interferometer. Consequently, high-speed operations, as well as superior positioning accuracy, can be achieved. Elimination of mask damage Since this is a non-contact projection exposure system, the mask and workpiece do not come into direct contact. Accordingly, the attached resist does not damage the mask. This not only prevents wiring pattern defects but also makes it possible to use the mask semipermanently, reducing running costs. Moreover, since the mask requires no cleaning, we expect improved equipment utilization compared to close contact exposure systems. High overlay accuracy maintained despite board expansion and contraction The “auto scale function” corrects the projection magnification by automatically changing the magnification up to 0.1% according to the expansion or contraction, greatly reducing the deviation in alignment. APPLICATIONS FC-BGA FC-CSP Interposer 2.1D 2.5D Packaging Semiconductor post-processing RDL Passivation TSV TSV bottom hole Printed circuit board

Ushio provides specialized steppers for cutting-edge packaging applications employed in servers and PCs, and in portable devices such as smart phones and tablet PCs. The stepper is intended for package substrates using a stage corresponding to the panel size and Ushio’s proprietary large-area projection lens technology cultivated from many years of expertise in light source and optical technology. High productivity is achieved while realizing the high resolution and overlay accuracy required for the latest packaging substrates.

Component Technology

– Includes the world’s best-selling super high-pressure UV lamp

– Ushio’s irradiation optical system boasts a high degree of uniformity

– Unrivaled large-area projector lens

FEATURES & BENEFITS

  • Proprietary TTL non-exposure wavelength alignment system
    When observing mask marks using Ushio’s patented “TTL non-exposure wavelength alignment” technology, exposure up to the alignment marks of the substrate is unnecessary. In addition, since work marks can be directly observed, there is no reduction in contrast due to masks, enabling accurate alignment using clear marks.
  • Suits a variety of alignment marks
    “Pattern matching support” for registered patterns does not require particular alignment marks, alignment can be achieved through a variety of wiring patterns.
  • High resolution
    High resolution is obtained by using Ushio’s projection lens for the “UPL series”. Line-space = 5μm design rule full-scale mass production support.
  • Long depth of field
    Due to the long depth of field (±50 to ±100), even if differences in levels, warpage or unevenness in the board cause focal deviation, the pattern profile equivalent to the profile in focus is obtained. This feature is particularly effective when exposure is performed for a thick, dry film or solder resist.
  • High-speed step-and-repeat by surface stages
    Precision air bearings are used to reduce friction, and a plane motor configuration is used to reduce the weight of all moving parts and increase their rigidity. As a result, it is possible to perform high-speed step-and-repeat operations. In addition, the surface stage exerts feedback control using a laser interferometer. Consequently, high-speed operations, as well as superior positioning accuracy, can be achieved.
  • Elimination of mask damage
    Since this is a non-contact projection exposure system, the mask and workpiece do not come into direct contact. Accordingly, the attached resist does not damage the mask. This not only prevents wiring pattern defects but also makes it possible to use the mask semipermanently, reducing running costs. Moreover, since the mask requires no cleaning, we expect improved equipment utilization compared to close contact exposure systems.
  • High overlay accuracy maintained despite board expansion and contraction
    The “auto scale function” corrects the projection magnification by automatically changing the magnification up to 0.1% according to the expansion or contraction, greatly reducing the deviation in alignment.

APPLICATIONS

  • FC-BGA
  • FC-CSP
  • Interposer
  • 2.1D
  • 2.5D
  • Packaging
  • Semiconductor post-processing
  • RDL
  • Passivation
  • TSV
  • TSV bottom hole
  • Printed circuit board
Supplier's Site

Technical Specifications

  Ushio America, Inc.
Product Category Lithography Equipment
Product Number UX-5 & UX-7
Product Name Large Field Stepper
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