This projection aligner uses our unique large area projector lens technology, light source and other optical technologies developed by Ushio over many years. Provides one-shot exposure of up to 8-inch wafers without touching the mask. Large depth of field enables proper exposure of non-flat wafers, achieving higher productivity and yield not possible with a proximity aligner.
Component Technology
– Includes the world’s number one super high-pressure UV lamp
– Our own irradiation optical system boasting a high degree of uniformity
– Unrivaled large-area projector lens
FEATURES & BENEFITS
Mask-damage free
High productivity
3-dimensional exposure
Thick-film resist support
Proximity aligner mask diversion possible
APPLICATIONS
MEMS
Crystal oscillators
SAW filters
RF devices
Sensors
Inkjet heads
Diodes
IGBT
Power semiconductors
Thyristors
MOS-FETs
LEDs
Power amps
MMICs
BAW filters
Acceleration sensors
Inductors
Passive components
Solar cells and more
This projection aligner uses our unique large area projector lens technology, light source and other optical technologies developed by Ushio over many years. Provides one-shot exposure of up to 8-inch wafers without touching the mask. Large depth of field enables proper exposure of non-flat wafers, achieving higher productivity and yield not possible with a proximity aligner.
Component Technology
– Includes the world’s number one super high-pressure UV lamp
– Our own irradiation optical system boasting a high degree of uniformity
– Unrivaled large-area projector lens
FEATURES & BENEFITS
- Mask-damage free
- High productivity
- 3-dimensional exposure
- Thick-film resist support
- Proximity aligner mask diversion possible
APPLICATIONS
- MEMS
- Crystal oscillators
- SAW filters
- RF devices
- Sensors
- Inkjet heads
- Diodes
- IGBT
- Power semiconductors
- Thyristors
- MOS-FETs
- LEDs
- Power amps
- MMICs
- BAW filters
- Acceleration sensors
- Inductors
- Passive components
- Solar cells and more
