The TechniPad SMT System is an advanced electroless nickel/immersion gold (ENIG) process that, with the addition of electroless palladium (ENEPIG), can provide a gold wire bondable surface and improve solderability of lead free assemblies. The process has been specifically developed to meet the challenges of selective plating of printed circuit board features. The TechniPad SMT System incorporates a mid-phosphorous electroless nickel (8–10% w/w) with a replenishable, non-porous immersion gold and a low phosphorus electroless palladium. The TechniPad SMT System meets all the requirements for solderability and wire bondability applicable with a 2-3µ” gold deposit on electroless nickel or on palladium.
| Technic, Inc. | |
|---|---|
| Product Category | SMT Manufacturing Equipment |
| Product Name | TechniPad SMT System |
