Technic, Inc. TechniFlex CU 120

Description
TechniFlex CU 120 is a high speed, stress free copper specifically designed for Flexible Circuits. Unlike standard acid copper processes, the TechniFlex CU 120 is capable of plating at over 40 ASF (4 ASD) in standard process tanks. The use of unique leveling agents helps to overcome incomplete coverage in sputtered coatings, making it ideal for plating of seed layer flex or direct metallization systems.
  • TechniFlex CU 120 - Technic, Inc.
    Technic, Inc.
Description
TechniFlex CU 120 is a high speed, stress free copper specifically designed for Flexible Circuits. Unlike standard acid copper processes, the TechniFlex CU 120 is capable of plating at over 40 ASF (4 ASD) in standard process tanks. The use of unique leveling agents helps to overcome incomplete coverage in sputtered coatings, making it ideal for plating of seed layer flex or direct metallization systems.

Suppliers

Company
Product
Description
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TechniFlex CU 120 - - Technic, Inc.
Technic, Inc.
Cranston, RI, USA
TechniFlex CU 120
TechniFlex CU 120
TechniFlex CU 120 is a high speed, stress free copper specifically designed for Flexible Circuits. Unlike standard acid copper processes, the TechniFlex CU 120 is capable of plating at over 40 ASF (4 ASD) in standard process tanks. The use of unique leveling agents helps to overcome incomplete coverage in sputtered coatings, making it ideal for plating of seed layer flex or direct metallization systems.

TechniFlex CU 120 is a high speed, stress free copper specifically designed for Flexible Circuits. Unlike standard acid copper processes, the TechniFlex CU 120 is capable of plating at over 40 ASF (4 ASD) in standard process tanks. The use of unique leveling agents helps to overcome incomplete coverage in sputtered coatings, making it ideal for plating of seed layer flex or direct metallization systems.

Supplier's Site

Technical Specifications

  Technic, Inc.
Product Category Plating Chemicals and Anodizing Chemicals
Product Name TechniFlex CU 120
Chemical / Composition Copper Plating
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