A cyanide immersion gold process operating on a completely novel mechanism of gold reduction in the presence of nickel and Techni IM Gold AT6100 additive. During this reaction Ni is not removed from the substrate. This eliminates all of the corrosion associated with black pad and hyper corrosion found in a typical cyanide based immersion gold process. The additive is not a traditional reducing agent as the reaction stops once the Ni is coated creating a pore free deposit. In production this translates to improved solderability and reduced gold usage.
| Technic, Inc. | |
|---|---|
| Product Category | Plating Chemicals and Anodizing Chemicals |
| Product Name | Techni IM Gold AT8000 |
| Chemical / Composition | Gold Plating |
