Technic, Inc. Cobalt Hardened Gold Plating Process Techni Gold® 900

Description
Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.
Description
Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.

Suppliers

Company
Product
Description
Supplier Links
Cobalt Hardened Gold Plating Process - Techni Gold® 900 - Technic, Inc.
Cranston, RI, USA
Cobalt Hardened Gold Plating Process
Techni Gold® 900
Cobalt Hardened Gold Plating Process Techni Gold® 900
Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.

Gold plating process using pulse plating technology to produce low-porosity deposits in electronic component and connector applications.

Technical Specifications

  Technic, Inc.
Product Category Plating Chemicals and Anodizing Chemicals
Product Number Techni Gold® 900
Product Name Cobalt Hardened Gold Plating Process
Chemical / Composition Gold Plating
Unlock Full Specs
to access all available technical data

Similar Products

Precious Metal Plating for Electronic Connectors - Pure Palladium - MacDermid Alpha Electronics Solutions
Specs
Chemical / Composition Silver Plating; Tin Plating
View Details
Techni MSI CuCN Bright Copper Cyanide -  - Technic, Inc.
Specs
Chemical / Composition Copper Plating
View Details
CHEMEON Zincate 8000 -  - CHEMEON Surface Technology, LLC
CHEMEON Surface Technology, LLC
Specs
Chemical / Composition Zinc Plating
View Details
Alkaline Zinc Plating - COLZINC® ACF-II - Columbia Chemical Corporation
Columbia Chemical Corporation
Specs
Chemical / Composition Zinc Plating
Form Liquid / Solution
View Details