TE Connectivity Internal I/O Connectors 2333799-3

Configuration Features Number of Positions : 168 Number of Rows : 2 PCB Mount Orientation : Vertical Contact Features Contact Base Material : Copper Alloy Contact Current Rating (Max) (AMP) : 1.1 Contact Mating Area Plating Material : Gold (Au) Contact Mating Area Plating Material Thickness : .762 MICM  [30 MICIN ] Contact Underplating Material : Nickel PCB Contact Termination Area Plating Material : Tin Housing Features Centerline (Pitch) : .6 MM  [.023 INCH ] Industry Standards Industry Standard : Gen-Z, OCP NIC 3.0 Mechanical Attachment Connector Mounting Type : Board Mount Operation/Applicatio n Circuit Application : Signal Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector Mates With : PCB Edge Card Internal I/O Connector Type : Sliver for SFF-TA-1002 Termination Features Termination Method to PCB : Surface Mount Usage Conditions Operating Temperature Range : -55 - 85 DEGC  [-67 - 185 DEGF ]