Configuration Features Board-to-Board Configuration : Parallel Number of Positions : 80 PCB Mount Orientation : Vertical
Contact Features Contact Current Rating (Max) (AMP) : .8 Contact Mating Area Plating Material : Gold Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ] Contact Type : Receptacle
Housing Features Centerline (Pitch) : .8 MM [.023 INCH ] Housing Color : Black Housing Material : Thermoplastic
Industry Standards UL Flammability Rating : UL 94V-0
Mechanical Attachment Connector Mounting Type : Board Mount Mating Alignment : Without PCB Mount Alignment : Without PCB Mount Retention : Without
Operation/Applicatio
n Circuit Application : Signal
Packaging Features Packaging Method : Tape
Product Type Features Connector & Contact Terminates To : Printed Circuit Board Connector System : Board-to-Board Header Type : Fully Shrouded PCB Connector Assembly Type : PCB Mount Receptacle Sealable : No
Termination Features Termination Method to Printed Circuit Board : Surface Mount
Usage Conditions Operating Temperature Range : -40 - 125 DEGC [-40 - 257 DEGF ]
Configuration Features
Board-to-Board Configuration : Parallel
Number of Positions : 80
PCB Mount Orientation : Vertical
Contact Features
Contact Current Rating (Max) (AMP) : .8
Contact Mating Area Plating Material : Gold
Contact Mating Area Plating Material Thickness : .76 MICM [30 MICIN ]
Contact Type : Receptacle
Housing Features
Centerline (Pitch) : .8 MM [.023 INCH ]
Housing Color : Black
Housing Material : Thermoplastic
Industry Standards
UL Flammability Rating : UL 94V-0
Mechanical Attachment
Connector Mounting Type : Board Mount
Mating Alignment : Without
PCB Mount Alignment : Without
PCB Mount Retention : Without
Operation/Application
Circuit Application : Signal
Packaging Features
Packaging Method : Tape
Product Type Features
Connector & Contact Terminates To : Printed Circuit Board
Connector System : Board-to-Board
Header Type : Fully Shrouded
PCB Connector Assembly Type : PCB Mount Receptacle
Sealable : No
Termination Features
Termination Method to Printed Circuit Board : Surface Mount
Usage Conditions
Operating Temperature Range : -40 - 125 DEGC [-40 - 257 DEGF ]
