TE Connectivity
PCB Terminals
1-1627334-0
Description
Contact Features Contact Mating Area Plating Material Thickness : 5 MICM [196.85 MICIN ] Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.25 MICM [50 MICIN ] Mating Tab Thickness : .8 MM [.03 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 5 MICM [196.85 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions PCB Thickness (Recommended) : .8 MM [.031 INCH ] Profile Height from PCB : 10 MM [.393 INCH ]
Mechanical Attachment Wire Insulation Support : Without
Packaging Features Packaging Method : Reel Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : 90 DEGC [194 DEGF ]
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Description
Contact Features Contact Mating Area Plating Material Thickness : 5 MICM [196.85 MICIN ] Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.25 MICM [50 MICIN ] Mating Tab Thickness : .8 MM [.03 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 5 MICM [196.85 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions PCB Thickness (Recommended) : .8 MM [.031 INCH ] Profile Height from PCB : 10 MM [.393 INCH ]
Mechanical Attachment Wire Insulation Support : Without
Packaging Features Packaging Method : Reel Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : 90 DEGC [194 DEGF ]
Request a Quote
Email Supplier
Suppliers
Contact Features Contact Mating Area Plating Material Thickness : 5 MICM [196.85 MICIN ] Contact Underplating Material : Nickel Contact Underplating Material Thickness : 1.25 MICM [50 MICIN ] Mating Tab Thickness : .8 MM [.03 INCH ] Mating Tab Width : 6.35 MM [.25 INCH ] PCB Contact Termination Area Plating Material Thickness : 5 MICM [196.85 MICIN ] PCB Terminal Type : Tab Terminal Orientation : Straight Terminal Plating Material : Tin Terminal Size : 6.35
Dimensions PCB Thickness (Recommended) : .8 MM [.031 INCH ] Profile Height from PCB : 10 MM [.393 INCH ]
Mechanical Attachment Wire Insulation Support : Without
Packaging Features Packaging Method : Reel Packaging Quantity : 1000
Termination Features Product Terminates To : Printed Circuit Board Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions Insulation Option : Uninsulated Operating Temperature Range : 90 DEGC [194 DEGF ]
Contact Features
- Contact Mating Area Plating Material Thickness : 5 MICM [196.85 MICIN ]
- Contact Underplating Material : Nickel
- Contact Underplating Material Thickness : 1.25 MICM [50 MICIN ]
- Mating Tab Thickness : .8 MM [.03 INCH ]
- Mating Tab Width : 6.35 MM [.25 INCH ]
- PCB Contact Termination Area Plating Material Thickness : 5 MICM [196.85 MICIN ]
- PCB Terminal Type : Tab
- Terminal Orientation : Straight
- Terminal Plating Material : Tin
- Terminal Size : 6.35
Dimensions
- PCB Thickness (Recommended) : .8 MM [.031 INCH ]
- Profile Height from PCB : 10 MM [.393 INCH ]
Mechanical Attachment
- Wire Insulation Support : Without
Packaging Features
- Packaging Method : Reel
- Packaging Quantity : 1000
Termination Features
- Product Terminates To : Printed Circuit Board
- Termination Method to Printed Circuit Board : Through Hole - Solder
Usage Conditions
- Insulation Option : Uninsulated
- Operating Temperature Range : 90 DEGC [194 DEGF ]
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Technical Specifications
|
Product Category
|
Wire Terminals |
|
Product Number
|
1-1627334-0 |
|
Product Name
|
PCB Terminals |
|
Material
|
Tin
|
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