Qnnect, formerly Hermetic Solutions Group Window Lids

Description
Lids with integrated windows, manufactured by Qnnect, formerly Hermetic Solutions Group, allow light to be transmitted from or received by optical components residing within the hermetic package.
Description
Lids with integrated windows, manufactured by Qnnect, formerly Hermetic Solutions Group, allow light to be transmitted from or received by optical components residing within the hermetic package.

Suppliers

Company
Product
Description
Supplier Links
Window Lids -  - Qnnect, formerly Hermetic Solutions Group
Painesville, OH, United States
Window Lids
Window Lids
Lids with integrated windows, manufactured by Qnnect, formerly Hermetic Solutions Group, allow light to be transmitted from or received by optical components residing within the hermetic package.

Lids with integrated windows, manufactured by Qnnect, formerly Hermetic Solutions Group, allow light to be transmitted from or received by optical components residing within the hermetic package.

Supplier's Site

Technical Specifications

  Qnnect, formerly Hermetic Solutions Group
Product Category Electronic Packages and Lids
Product Name Window Lids
Package Material Kovar
Unlock Full Specs
to access all available technical data

Similar Products

Axle Angle Converter Hermetic Package -  - OptiSpac, Inc.
Specs
Package Material Steel (optional feature)
Hermeticity ≤ 1x10-3Pa●cm3/s(He)
Insulation Resistance ≥1x1010Ω(500V●DC)
View Details
Implantable Packaging -  - Qnnect, formerly Hermetic Solutions Group
Qnnect, formerly Hermetic Solutions Group
Specs
Package Material Titanium
Hermeticity 1x10-9 He@1ATM
View Details
ATG Unibody Dual In-Line Headers -  - Advanced Technology Group, Inc.
Advanced Technology Group, Inc.
Specs
Package Material Pins and Frame: ASTM F-15 Kovar alloy per Mil-I-23011, Class 1. Glass: Corning 7052 or equivalent.
View Details
Multi-Chip RF Function Module Hermetic Package -  - OptiSpac, Inc.
Specs
Package Material Copper (optional feature); Tungsten (optional feature); CPC, Cu-Dia
Hermeticity ≤ 1x10-3Pa●cm3/s(He)
Insulation Resistance ≥1x1010Ω(500V●DC)
View Details