KMC Series includes high-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments. Space grade/ESA/ESCC qualified are also available.
Features & Benefits
High density interconnection, up to 162 ways
Termination styles: wire wrap, solder cup and through board solder
NF C-UTE C 93-424, ESA/ESCC3401/016 - 3401/017
Polarized guiding devices, 16 keys available
Fretting proof - endurance
KMC Series includes high-density board to board and board to wire interconnect solutions available in multiple configurations from 26 to 162 positions with a 0.5mm contact diameter and is widely used in harsh environments. Space grade/ESA/ESCC qualified are also available.
Features & Benefits
- High density interconnection, up to 162 ways
- Termination styles: wire wrap, solder cup and through board solder
- NF C-UTE C 93-424, ESA/ESCC3401/016 - 3401/017
- Polarized guiding devices, 16 keys available
- Fretting proof - endurance
