Skyworks Solutions, Inc. 0.1 – 3.0 GHz SPDT High Power Switch (Single Bit Control) in a WLCSP Package SKY13448-001

Description
Please note: SKY13448-001 is being discontinued and is not recommended for new designs. The SKY13448-001 is a Single-Pole, Double-Throw (SPDT) LTE/WCDMA/GSM transmit switch. Switching is controlled by an integrated GPIO interface with a single control pin. Depending on the logic voltage level applied to the control pin, the antenna port is connected to one of the switched RF outputs (RF1 or RF2) through a low insertion loss path, while the path between the antenna port and the other RF port is in a high isolation state. No external DC blocking capacitors are required as long as no DC voltage is applied on any RF path. The SKY13448-001 is provided in a compact 8-bump, 1.1 x 1.1 x 0.36 mm Wafer Level Chip Scale Package (WLCSP) that meets requirements for board-level assembly. Bump diameters are 200 microns with a minimum bump pitch of 400 microns.
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Description
Please note: SKY13448-001 is being discontinued and is not recommended for new designs. The SKY13448-001 is a Single-Pole, Double-Throw (SPDT) LTE/WCDMA/GSM transmit switch. Switching is controlled by an integrated GPIO interface with a single control pin. Depending on the logic voltage level applied to the control pin, the antenna port is connected to one of the switched RF outputs (RF1 or RF2) through a low insertion loss path, while the path between the antenna port and the other RF port is in a high isolation state. No external DC blocking capacitors are required as long as no DC voltage is applied on any RF path. The SKY13448-001 is provided in a compact 8-bump, 1.1 x 1.1 x 0.36 mm Wafer Level Chip Scale Package (WLCSP) that meets requirements for board-level assembly. Bump diameters are 200 microns with a minimum bump pitch of 400 microns.
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0.1 – 3.0 GHz SPDT High Power Switch (Single Bit Control) in a WLCSP Package - SKY13448-001 - Skyworks Solutions, Inc.
Irvine, CA, United States
0.1 – 3.0 GHz SPDT High Power Switch (Single Bit Control) in a WLCSP Package
SKY13448-001
0.1 – 3.0 GHz SPDT High Power Switch (Single Bit Control) in a WLCSP Package SKY13448-001
Please note: SKY13448-001 is being discontinued and is not recommended for new designs. The SKY13448-001 is a Single-Pole, Double-Throw (SPDT) LTE/WCDMA/GSM transmit switch. Switching is controlled by an integrated GPIO interface with a single control pin. Depending on the logic voltage level applied to the control pin, the antenna port is connected to one of the switched RF outputs (RF1 or RF2) through a low insertion loss path, while the path between the antenna port and the other RF port is in a high isolation state. No external DC blocking capacitors are required as long as no DC voltage is applied on any RF path. The SKY13448-001 is provided in a compact 8-bump, 1.1 x 1.1 x 0.36 mm Wafer Level Chip Scale Package (WLCSP) that meets requirements for board-level assembly. Bump diameters are 200 microns with a minimum bump pitch of 400 microns.

Please note: SKY13448-001 is being discontinued and is not recommended for new designs.

The SKY13448-001 is a Single-Pole, Double-Throw (SPDT) LTE/WCDMA/GSM transmit switch. Switching is controlled by an integrated GPIO interface with a single control pin. Depending on the logic voltage level applied to the control pin, the antenna port is connected to one of the switched RF outputs (RF1 or RF2) through a low insertion loss path, while the path between the antenna port and the other RF port is in a high isolation state.
No external DC blocking capacitors are required as long as no DC voltage is applied on any RF path.
The SKY13448-001 is provided in a compact 8-bump, 1.1 x 1.1 x 0.36 mm Wafer Level Chip Scale Package (WLCSP) that meets requirements for board-level assembly. Bump diameters are 200 microns with a minimum bump pitch of 400 microns.

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Technical Specifications

  Skyworks Solutions, Inc.
Product Category RF Switches
Product Number SKY13448-001
Product Name 0.1 – 3.0 GHz SPDT High Power Switch (Single Bit Control) in a WLCSP Package
Package Type Surface Mount; WLCSP, 8-bump
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