Samtec Inc. Mini Mate™ Wire-to-Board System Discrete Wire Crimp Contact CC79R Series

Description
15,000 Contact Per Reel Tin Plating Contact for IPD1 Series
Description
15,000 Contact Per Reel Tin Plating Contact for IPD1 Series

Suppliers

Company
Product
Description
Supplier Links
Mini Mate™ Wire-to-Board System Discrete Wire Crimp Contact - CC79R Series - Samtec Inc.
New Albany, IN, USA
Mini Mate™ Wire-to-Board System Discrete Wire Crimp Contact
CC79R Series
Mini Mate™ Wire-to-Board System Discrete Wire Crimp Contact CC79R Series
15,000 Contact Per Reel Tin Plating Contact for IPD1 Series
  • 15,000 Contact Per Reel
  • Tin Plating
  • Contact for IPD1 Series
Supplier's Site

Technical Specifications

  Samtec Inc.
Product Category Electrodes and Electrode Materials
Product Number CC79R Series
Product Name Mini Mate™ Wire-to-Board System Discrete Wire Crimp Contact
Type Contact
Unlock Full Specs
to access all available technical data

Similar Products

Battery Electrode Materials - MicroGrid® - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
Type Anode / Anode Material; Cathode / Cathode Material
Material Aluminum (optional feature); Titanium (optional feature); Zinc (optional feature); Cu (optional feature)
Applications Battery or Fuel Cell (optional feature)
View Details
Automotive Terminals - 1060-20-0622 - TE Connectivity
Specs
Type Contact
Plating / Coating Nickel; Nickel (Ni)
Applications Motor or Generator
View Details
Mini Mate™ Wire-to-Board System Discrete Wire Crimp Contact - CC79L Series - Samtec Inc.
Specs
Type Contact
Shape / Form Socket or Receptacle
Plating / Coating Tin
View Details