Samtec Inc. Mini Mate™ Wire-to-Board System Discrete Wire Crimp Contact CC79L Series

Description
Tin Plating Contact for IPD1 Series
Description
Tin Plating Contact for IPD1 Series

Suppliers

Company
Product
Description
Supplier Links
Mini Mate™ Wire-to-Board System Discrete Wire Crimp Contact - CC79L Series - Samtec Inc.
New Albany, IN, USA
Mini Mate™ Wire-to-Board System Discrete Wire Crimp Contact
CC79L Series
Mini Mate™ Wire-to-Board System Discrete Wire Crimp Contact CC79L Series
Tin Plating Contact for IPD1 Series
  • Tin Plating
  • Contact for IPD1 Series
Supplier's Site

Technical Specifications

  Samtec Inc.
Product Category Electrodes and Electrode Materials
Product Number CC79L Series
Product Name Mini Mate™ Wire-to-Board System Discrete Wire Crimp Contact
Type Contact
Unlock Full Specs
to access all available technical data

Similar Products

Automotive Terminals - 1-1326030-0 - TE Connectivity
Specs
Type Contact
Plating / Coating Tin; Tin (Sn)
Applications Motor or Generator
View Details
Battery Electrode Materials - PolyGrid® - Dexmet® Corporation, a part of PPG’s engineered materials division
Dexmet® Corporation, a part of PPG’s engineered materials division
Specs
OD / Width 12 to 48 inch (305 to 1219 mm)
Thickness 0.0020 to 0.0400 inch (0.0508 to 1.02 mm)
View Details
Crimp Contacts - 2080723 - RS Components, Ltd.
Specs
Shape / Form Pin
Contact Material Cu; Beryllium Copper Alloy
Plating / Coating Gold; Nickel; Gold over Nickel
View Details
2 suppliers