Rego Electronics Inc. Socket H LGA CPU Cooler RG3121-P

Description
We offer a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed to precisely measure its performance. We are here to provide customized thermal solutions according to your specifications. Outline Dimension : 90 x 90 x 25 mm Heat Sink : Forged AL6063 fins with C1100 Base Thermal Resistance : 0.25 ℃/W @ 800LFM Weight : 273 g
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Description
We offer a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed to precisely measure its performance. We are here to provide customized thermal solutions according to your specifications. Outline Dimension : 90 x 90 x 25 mm Heat Sink : Forged AL6063 fins with C1100 Base Thermal Resistance : 0.25 ℃/W @ 800LFM Weight : 273 g
Request a Quote

Suppliers

Company
Product
Description
Supplier Links
Socket H LGA CPU Cooler - RG3121-P - Rego Electronics Inc.
New Taipei, Taiwan
Socket H LGA CPU Cooler
RG3121-P
Socket H LGA CPU Cooler RG3121-P
We offer a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed to precisely measure its performance. We are here to provide customized thermal solutions according to your specifications. Outline Dimension : 90 x 90 x 25 mm Heat Sink : Forged AL6063 fins with C1100 Base Thermal Resistance : 0.25 ℃/W @ 800LFM Weight : 273 g

We offer a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Our products are well designed in thermal performance based on our professional manufacturing know how. We also have the sophisticated equipment needed to precisely measure its performance. We are here to provide customized thermal solutions according to your specifications.

Outline Dimension : 90 x 90 x 25 mm
Heat Sink : Forged AL6063 fins with C1100 Base
Thermal Resistance : 0.25 ℃/W @ 800LFM
Weight : 273 g

Supplier's Site

Technical Specifications

  Rego Electronics Inc.
Product Category CPU Coolers
Product Number RG3121-P
Product Name Socket H LGA CPU Cooler
Device Passive Heat Sink
L 90 mm (3.54 inch)
W 90 mm (3.54 inch)
H 25 mm (0.9843 inch)
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